One Stop Systems
OSS-XMC-HIB25-X8
Specifications subject to change without notice
Page 4
1.c. Conceptual architecture
1.d. Host interface board specifications
Form Factor
XMC card; does not include PMC connectors
Operating Temperature
0˚C to +70˚C environment
Storage Temperature
-
40˚C to 85˚C
Operating Humidity
10% to 90% relative humidity non-condensing
Storage Humidity
5% to 95% relative humidity non-condensing
Power
3.3V
Connectors
• PCIe x8 cable connector
• XMC P15 connector
Industry Specifications
• PCIe External Cabling Specification, Rev. 1.0
• PCI Express™ Card Electromechanical Specification,
Rev. 2.0
• PCI Express ® Base Specification, Rev. 2.0
• VITA 42.0-2005
• ANSI/VITA 42.3-2006
Re-drivers
• 5.0 Gbps 4-Lane PCI Express Gen 2 Re-Driver
with Equalization & de-emphasis
• Pericom Part number PI2EQX5804
Bracket
• XMC bezel
• LEDs on bracket
Agency Compliance
Designed to Meet:
• FCC Class B
• CE
PCB
• Form Factor: Short XMC.3
• PCIe x8 cable connector to front panel
• PCB thickness .063 +/- 0.008 inch (1.6 +/-0.2 mm)
• PCIe signals routed with 85 ohm differential
impedance
• Two stand-off mounting holes
PCIe backplane in
the host enclosure
PCIe backplane in the
target system
Downstream target adapter
XMC-HIB25 in
host mode
X8 PCIe cable
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