September, 2014
Page 3 of 8
to use an appropriate pick and place tool
and to ensure that the process parameters
are conform to the package's characteristics.
Figure 6 shows the recommended design of
the placement tool for damage-free process-
ing of the SYNIOS P2720.
Fig. 5: Position of the LED in the tape
– method of taping
Fig. 6: Design proposals of the pick and place tool for the SYNIOS P2720 (dimensions in
mm)
If possible, the tool should pick up the LED
across the entire surface or along the
package rim (Figure 7). The same applies
when depositing or placing the LED. Forces
Application Note Number: AN038
