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2020-06-04 | Document No.: AN149
Figure 21: Temperature profile for lead-free reflow soldering in accordance with JEDEC
J-STD-020E
Vacuum reflow option.
If a very low level (<10%) needs to be achieved, a
vacuum reflow soldering oven can be used.
To ensure optimized heat transfer from the integrated thermal pad to the PCB
and high board level reliability, it is recommended to control the solder joint
quality of the first assembled samples with an X-ray image. The X-ray images in
Figure 22 show good solder joint quality with no bridging and very low voiding.
Figure 22: X-ray images of the solder joint quality
0
50
100
150
200
250
300
t [s]
0
50
100
150
200
250
300
25
T [°C]
up to 120 s
up to 30 s
up to 100 s
Ramp up
3 K/s (max)
Ramp down
6 K/s (max)
245 °C Recommended solder profile
(max 260 °C)
217 °C
240 °C
