ON Semiconductor NCL30073LED4GEVB, Руководство пользователя

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NCL30073LED4GEVB
www.onsemi.com
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Figure 6. PCB Outline
Circuit Board Fabrication Notes
1. Fabricate per IPC − 6011 and IPC6012. Inspect to
IPA − A − 600 Class 2 or updated standard.
2. Printed Circuit Board is defined by files listed in
fileset.
3. Modification to copper within the PCB outline is
not allowed without permission, except where
noted otherwise. The manufacturer may make
adjustments to compensate for manufacturing
process, but the final PCB is required to reflect the
associated gerber file design
±
0.001 in. for etched
features within the PCB outline.
4. Material in accordance with IPC − 4101/21, FR4,
Tg 125 ° C min.
5. Layer to layer registration shall not exceed
± 0.004 in.
6. External finished copper conductor thickness shall
be 0.0026 in. min. (ie 2oz)
7. Copper plating thickness for through holes shall be
0.0013 in. min. (ie 1oz)
8. All holes sizes are finished hole size.
9. Finished PCB thickness 0.062 in.
10. All un - dimensioned holes to be drilled using the
NC drill data.
11. Size tolerance of plated holes: ± 0.003 in. :
non − plated holes ± 0.002 in.
12. All holes shall be ± 0.003 in. of their true position
U.D.S.
13. Construction to be SMOBC, using liquid photo
image (LPI) solder mask in accordance with
IPC
− SM − B40C, Type B, Class 2, and be green in
color.
14. Solder mask mis - registration ± 0.004 in. max.
15. Silkscreen shall be permanent non − conductive
white ink.
16. The fabrication process shall be UL approved and
the PCB shall have a flammability rating of
UL94V0 to be marked on the solder side in
silkscreen with date, manufactures approved logo,
and type designation.
17. Warp and twist of the PCB shall not exceed
0.0075 in. per in.
18. 100% electrical verification required.
19. Surface finish: electroless nickel immersion gold
(ENIG)
20. RoHS 2002/95/EC compliance required.