NB7L216MNEVB
http://onsemi.com
9
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G
−
01
ISSUE B
16X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
4
5
8
12
9
16
13
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. L
max
CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
ÇÇÇ
ÇÇÇ
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.10 C
0.08 C
(A3)
C
16 X
e
16X
NOTE 5
0.10 C
0.05 C
A B
NOTE 3
K
16X
DIM MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2
1.65
1.85
E
3.00 BSC
E2
1.65
1.85
e
0.50 BSC
K
0.20
−−−
L
0.30
0.50
EXPOSED PAD
ǒ
mm
inches
Ǔ
SCALE 10:1
0.50
0.02
0.575
0.022
1.50
0.059
3.25
0.128
0.30
0.012
3.25
0.128
0.30
0.012
EXPOSED PAD
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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