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©

 Semiconductor Components Industries, LLC, 2012

February, 2012 

 Rev. 2

1

Publication Order Number:

EVBUM2077/D

NB4N527SMNEVB

Evaluation Board User's
Manual for NB4N527S

INTRODUCTION

ON Semiconductor has developed an evaluation board for

the NB4N527S device as a convenience for the customers
interested in performing their own device engineering
assessment. This board provides a high bandwidth 50 

W

controlled impedance environment. The pictures in Figure 1
show the top and bottom view of the evaluation board, which
can be configured in several different ways.
This evaluation board manual contains:

Information on 16

lead QFN Evaluation Board

Assembly Instructions

Appropriate Lab Setup

Bill of Materials

This manual should be used in conjunction with the

NB4N527S device data sheet, which contains full technical
details on the device specifications and operation.

Board Lay

Up

The 16

lead QFN evaluation board is implemented in

four layers with split (dual) power supplies (Figure 2,
Evaluation Board Lay

up). For standard lab setup, a split

(dual) power supply is essential to enable the 50 

W

 internal

impedance in the oscilloscope as a device termination. The
first layer or primary trace layer is 0.005

thick Rogers

RO6002 material, which is designed to have equal electrical
length on all signal traces from the device under the test
(DUT) to the sense output. The second layer is the 1.0 oz.
copper ground plane. The FR4 dielectric material is placed
between the second and third layer, and between the third
and fourth layer. The third layer is also a 1.0 oz copper
ground plane. The fourth layer is the secondary trace layer.

Top View

Bottom View

Figure 1. Top and Bottom View of the 16 QFN Evaluation Board

http://onsemi.com

EVAL BOARD USER’S MANUAL

Содержание NB4N527S

Страница 1: ...data sheet which contains full technical details on the device specifications and operation Board Lay Up The 16 lead QFN evaluation board is implemented in four layers with split dual power supplies...

Страница 2: ...he bottom side of the board between the appropriate input of the device pin pads and the ground pads for split power supply setup Likewise for CML outputs CML stimulus signal need to be terminated to...

Страница 3: ...2 J13 D U T 4 x Surface Mount Test Points 2 x 10 mF Decoupling Capacitors on the back of the PCB C4 C2 8 x SMA Connectors Top View SMA_GND VCC VEE Pin 1 Pad Wire DUT_GND SMA_GND 4 x 0 01 mF or 0 1 mF...

Страница 4: ...ctly to the scope head Power Supply VCC GND VEE D U T Differential Signal Generator Test Measuring Equipment Channel 1 Channel 2 Trigger Trigger Out Out Figure 5 Simplified Equipment Lab Setup Block D...

Страница 5: ...t Point 5015 4 http www keyelco com Chip Capacitor AVC Corporation 0603 0 01 mF 10 10 mF 10 06035C103KAT2A T491C106K016AS 4 2 http www avxcorp com Chip Resistor Panasonic 0402 50 W 1 Presicion Thick F...

Страница 6: ...NB4N527SMNEVB http onsemi com 6 Top Layer Second Layer SMA_GND Plane Figure 6 Gerber Files...

Страница 7: ...NB4N527SMNEVB http onsemi com 7 Third Layer DUT_GND Trace Bottom Layer Figure 7 Gerber Files...

Страница 8: ...CILLC product could create a situation where personal injury or death may occur Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application Buyer shall indemnify a...

Страница 9: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information ON Semiconductor NB4N527SMNEVB...

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