ON Semiconductor LM239, Справочное руководство

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LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
http://onsemi.com
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PACKAGE DIMENSIONS
PDIP−14
P SUFFIX
CASE 646−06
ISSUE M
1 7
14 8
B
A
DIM MIN MAX MIN MAX
MILLIMETERS INCHES
A
0.715 0.770 18.16 18.80
B
0.240 0.260 6.10 6.60
C
0.145 0.185 3.69 4.69
D
0.015 0.021 0.38 0.53
F
0.040 0.070 1.02 1.78
G
0.100 BSC 2.54 BSC
H
0.052 0.095 1.32 2.41
J
0.008 0.015 0.20 0.38
K
0.115 0.135 2.92 3.43
L
M
−−− 10 −−− 10
N
0.015 0.039 0.38 1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
H G
D
K
C
SEATING
PLANE
N
−T−
14 PL
M 0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P
7 PL
14
8
7
1
M
0.25 (0.010) B
M
S B M 0.25 (0.010) A S T
−T−
F
R
X 45
SEATING
PLANE D
14 PL
K
C
J
M
DIM MIN MAX MIN MAX
INCHES MILLIMETERS
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019