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ECLSOIC8EVB

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18

Appendix A (Modified Configurations)

MC10EL16D/MC100EL16D
MC100LVEL16D
MC10EP16D/MC100EP16D
MC10EP16DF/MC100EP16DF
MC100EP16VAD
MC100LVEP16D

The devices listed above have the option of being driven

single

endedly by using the provided V

BB

 pin of the device.

In order to drive it single

endedly, Configuration 2 needs to

be modified.

1. Remove the 50 

W

 chip resistor from R3.

2. Short pin 3 and pin 4 together.

Option A) Short R3 and R4 trace pads.

Or

Option B) Place a SMA connector on J4 and use

a cable with SMA connectors to short
J3 and J4 connectors.

MC10EP16D/MC100EP16DT

This device has an option of being 50 

W

 terminated

internally. To evaluate the internal 50 

W

 resistor of the

device, Configuration 2 needs to be modified.

1. Remove the 50 

W

 chip resistors from R2 and R3.

2. Short R1 and R4 to V

TT

 (GND).

Option A) Short R1 and R4 to V

TT

 (GND).

Or

Option B) Place SMA connectors on J1 and J4. 

Place shorting barrels on J1 and J4
SMA connector.

MC100EP16VBD

This device has an option of single

ended feedback

output and being driven single

endedly using the V

BB

. To

utilize the feedback option and drive it single

endedly,

Configuration 2 needs to be modified.
Feedback option

1. Connect a SMA connector on J1

Drive single

endedly

2. Remove the 50 

W

 chip resistor from R3.

3. Short pin 3 and pin 4 together.

Option A) Short R3 and R4.

Or

Option B) Place a SMA connector on J4 and use

a cable with SMA connectors to short
J3 and J4 connectors.

MC100EP16VCD

This device has an option of single

ended feedback

output with an enable pin. To utilize the feedback option and
enable option, Configuration 5 needs to be modified.

1. Connect a SMA connector on J1.
2. Remove the 50 

W

 chip resistor from R3.

MC100EP16VSD

This device has an option of varying the output swing

amplitude and being driven single

endedly. In order to

utilize these options, Configuration 2 needs to be modified.
Output Swing Control

1. Connect a SMA connector on J1
2. Add a decoupling capacitor between J1 and V

CC

(0.01 

m

F)

Drive Single

Endedly

1. Remove the 50 

W

 chip resistor from R3.

2. Short pin 3 and pin 4 together.

Option A) Short R3 and R4.

Or

Option B) Place a SMA connector on J4 and use

a cable with SMA connectors to short
J3 and J4 connectors.

MC100EP16VTD

This device has an option of varying the output swing

amplitude and internal termination. In order to utilize these
options, Configuration 2 needs to be modified.
Output Swing Control

1. Connect a SMA connector on J1
2. Add a decoupling capacitor between J1 and V

CC

(0.0 1 

m

F)

Internal Termination

1. Remove the 50 

W

 chip resistors from R2 and R3.

2. Short R1 and R4 to V

TT

 (GND)

Option A) Short R1 and R4 to V

TT 

(GND).

Or

Option B) Place SMA connectors on J1 and J4.

Place shorting barrels on J1 and J4
SMA connector.

MC10ELT21D/MC100EL21D
MC100EL23D
MC10ELT26D/MC100ELT26D
MC100EPT21D
MC100EPT23D
MC100EPT26D
MC100LVELT23

The TTL output data presented in the data sheet are obtained
under 500 

W

 load resistor in parallel with 20 pF fixture

capacitance. In order to obtain comparable data as in the data
sheet, the evaluation board needs to be modified.

1. Cut the output trace so that the 0402* size chip

resistor can be placed over the cut out trace.

2. Solder a 450 

W

 chip resistor across the cut out

trace.

*Any size chip resistor can be used. The recommended size of the

chip resistor is 0402, to reduce the effect of parasitic with a 17 mil

trace width. 450 

W

 in series with 50 

W

 instrument resistance add up

to 500 

W

 loaded condition.

Содержание ECLSOIC8EVB

Страница 1: ...e used in conjunction with the device data sheet which contains full technical details on the device specifications and operation Board Lay Up The 8 lead SOIC evaluation board is implemented in four l...

Страница 2: ...rent configurations The input output and power pin layout of the evaluation board is shown in Figure 3 The evaluation board has at least eleven possible configurable options Table 1 list the devices a...

Страница 3: ...32D See Figure 7 4 MC100LVEL33D See Figure 7 4 MC100LVEL51D See Figure 4 1 MC100LVEL58D See Figure 8 5 MC100LVELT22D See Figure 11 8 MC100LVELT23D See Figure 12 9 ECLinPS PlusE Device Comments Configu...

Страница 4: ...VEE and GND The VCC clip connects directly to pin 8 of the device The VEE clip connects directly to pin 5 of the device There are two GND clip footprints which can be connected to the ground plane of...

Страница 5: ...Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J7 R7 C1 C4 MC10EL01D MC100EL01D Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No Yes No Yes Yes MC10EL05D MC100EL05D MC10EL31D MC100EL31D MC10EL35D...

Страница 6: ...Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J7 R7 C1 C4 MC10EL04D MC100EL04D No No Yes Yes Yes Yes No No Yes Yes Yes No Yes No Yes Yes MC10EL07D MC100EL0...

Страница 7: ...ure 6 Configuration 3 Schematic R6 50 W Table 6 Configuration 3 Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Device J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J7 R7 C1 C4 MC10EL11D MC100EL11D Yes No Yes N...

Страница 8: ...in 8 Optional Figure 7 Configuration 4 Schematic R2 50 W R1 50 W Table 7 Configuration 4 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J7 R7 C1 C4 MC10EL32...

Страница 9: ...gure 8 Configuration 5 Schematic R3 50 W R2 50 W Table 8 Configuration 5 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J7 R7 C1 C4 MC100EP16VCD No No Yes Y...

Страница 10: ...3 Pin 2 Pin 1 Pin 5 Pin 6 Pin 7 Pin 8 Figure 9 Configuration 6 Translator Schematic Table 9 Configuration 6 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J...

Страница 11: ...Figure 10 Configuration 7 Translator Schematic Unloaded Testing Condition R2 50 W Table 10 Configuration 7 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6 J...

Страница 12: ...in 6 Pin 7 Pin 8 Figure 11 Configuration 8 Translator Schematic J6 J4 J1 R7 50 W optional Table 11 Configuration 8 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3...

Страница 13: ...iguration 9 Translator Schematic Unloaded Testing Condition R1 50 W R2 50 W R3 50 W R4 50 W Table 12 Configuration 9 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C...

Страница 14: ...Figure 13 Configuration 10 Translator Schematic Unloaded Testing Condition R3 50 W Table 13 Configuration 10 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3 R3 J4 R4 C2 C3 J6 R6...

Страница 15: ...2 Pin 1 Pin 5 Pin 6 Pin 7 Pin 8 J6 Figure 14 Configuration 11 Translator Schematic J2 J3 R1 50 W R2 50 W Table 14 Configuration 11 Device Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 J1 R1 J2 R2 J3...

Страница 16: ...ignals VTT VCC 2 0 V in split power supply setup VTT is the system ground VCC is 2 0 V and VEE is 3 0 V or 1 3 V see Table 15 Table 15 Power Supply Levels Power Supply VCC VEE GND 5 0 V 2 0 V 3 0 V 0...

Страница 17: ...Miniature Test Point 5015 http www keyelco com SMT Compact Test Point 5016 Thru Hole Mount Compact Test Point 5005 5009 Chip Capacitor AVC Corporation 0603 0 01 mF 10 06035C103KAT2A http www avxcorp c...

Страница 18: ...fied 1 Connect a SMA connector on J1 2 Remove the 50 W chip resistor from R3 MC100EP16VSD This device has an option of varying the output swing amplitude and being driven single endedly In order to ut...

Страница 19: ...Gerber Files Top Layer Second Layer VEE and Ground Plane Third Layer VCC and Ground Plane Figure 16 Gerber Files Bottom Layer ECLinPS ECLinPS Lite ECLinPS Plus and ECLinPS MAX are trademarks of Semic...

Страница 20: ...ems or any FDA Class 3 medical devices or medical devices with a similar or equivalent classification in a foreign jurisdiction or any devices intended for implantation in the human body Should you pu...

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