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TJA1055

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2013. All rights reserved.

Product data sheet

Rev. 5 — 6 December 2013 

24 of 26

NXP Semiconductors

TJA1055

Enhanced fault-tolerant CAN transceiver

17. Legal information

17.1 Data 

sheet 

status

 

[1]

Please consult the most recently issued document before initiating or completing a design. 

[2]

The term ‘short data sheet’ is explained in section “Definitions”. 

[3]

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status 
information is available on the Internet at URL

http://www.nxp.com

17.2 Definitions

Draft — 

The document is a draft version only. The content is still under 

internal review and subject to formal approval, which may result in 
modifications or additions. NXP Semiconductors does not give any 
representations or warranties as to the accuracy or completeness of 
information included herein and shall have no liability for the consequences of 
use of such information.

Short data sheet — 

A short data sheet is an extract from a full data sheet 

with the same product type number(s) and title. A short data sheet is intended 
for quick reference only and should not be relied upon to contain detailed and 
full information. For detailed and full information see the relevant full data 
sheet, which is available on request via the local NXP Semiconductors sales 
office. In case of any inconsistency or conflict with the short data sheet, the 
full data sheet shall prevail.

Product specification — 

The information and data provided in a Product 

data sheet shall define the specification of the product as agreed between 
NXP Semiconductors and its customer, unless NXP Semiconductors and 
customer have explicitly agreed otherwise in writing. In no event however, 
shall an agreement be valid in which the NXP Semiconductors product is 
deemed to offer functions and qualities beyond those described in the 
Product data sheet.

17.3 Disclaimers

Limited warranty and liability — 

Information in this document is believed to 

be accurate and reliable. However, NXP Semiconductors does not give any 
representations or warranties, expressed or implied, as to the accuracy or 
completeness of such information and shall have no liability for the 
consequences of use of such information. NXP Semiconductors takes no 
responsibility for the content in this document if provided by an information 
source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, 
punitive, special or consequential damages (including - without limitation - lost 
profits, lost savings, business interruption, costs related to the removal or 
replacement of any products or rework charges) whether or not such 
damages are based on tort (including negligence), warranty, breach of 
contract or any other legal theory. 

Notwithstanding any damages that customer might incur for any reason 
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards 
customer for the products described herein shall be limited in accordance 
with the 

Terms and conditions of commercial sale

 of NXP Semiconductors.

Right to make changes — 

NXP Semiconductors reserves the right to make 

changes to information published in this document, including without 
limitation specifications and product descriptions, at any time and without 
notice. This document supersedes and replaces all information supplied prior 
to the publication hereof.

Suitability for use in automotive applications — 

This NXP 

Semiconductors product has been qualified for use in automotive 
applications. Unless otherwise agreed in writing, the product is not designed, 
authorized or warranted to be suitable for use in life support, life-critical or 
safety-critical systems or equipment, nor in applications where failure or 
malfunction of an NXP Semiconductors product can reasonably be expected 
to result in personal injury, death or severe property or environmental 
damage. NXP Semiconductors and its suppliers accept no liability for 
inclusion and/or use of NXP Semiconductors products in such equipment or 
applications and therefore such inclusion and/or use is at the customer's own 
risk.

Applications — 

Applications that are described herein for any of these 

products are for illustrative purposes only. NXP Semiconductors makes no 
representation or warranty that such applications will be suitable for the 
specified use without further testing or modification. 

Customers are responsible for the design and operation of their applications 
and products using NXP Semiconductors products, and NXP Semiconductors 
accepts no liability for any assistance with applications or customer product 
design. It is customer’s sole responsibility to determine whether the NXP 
Semiconductors product is suitable and fit for the customer’s applications and 
products planned, as well as for the planned application and use of 
customer’s third party customer(s). Customers should provide appropriate 
design and operating safeguards to minimize the risks associated with their 
applications and products. 

NXP Semiconductors does not accept any liability related to any default, 
damage, costs or problem which is based on any weakness or default in the 
customer’s applications or products, or the application or use by customer’s 
third party customer(s). Customer is responsible for doing all necessary 
testing for the customer’s applications and products using NXP 
Semiconductors products in order to avoid a default of the applications and 
the products or of the application or use by customer’s third party 
customer(s). NXP does not accept any liability in this respect.

Limiting values — 

Stress above one or more limiting values (as defined in 

the Absolute Maximum Ratings System of IEC 60134) will cause permanent 
damage to the device. Limiting values are stress ratings only and (proper) 
operation of the device at these or any other conditions above those given in 
the Recommended operating conditions section (if present) or the 
Characteristics sections of this document is not warranted. Constant or 
repeated exposure to limiting values will permanently and irreversibly affect 
the quality and reliability of the device.

Terms and conditions of commercial sale — 

NXP Semiconductors 

products are sold subject to the general terms and conditions of commercial 
sale, as published at 

http://www.nxp.com/profile/terms

, unless otherwise 

agreed in a valid written individual agreement. In case an individual 
agreement is concluded only the terms and conditions of the respective 
agreement shall apply. NXP Semiconductors hereby expressly objects to 
applying the customer’s general terms and conditions with regard to the 
purchase of NXP Semiconductors products by customer.

Document status

[1][2]

Product status

[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for product development. 

Preliminary [short] data sheet

Qualification

This document contains data from the preliminary specification. 

Product [short] data sheet

Production

This document contains the product specification. 

Содержание TJA1055

Страница 1: ...benefits 2 1 Optimized for in car low speed communication Pin to pin compatible with TJA1054 and TJA1054A Baud rate up to 125 kBd Up to 32 nodes can be connected Supports unshielded bus wires Very lo...

Страница 2: ...nce with IEC 60747 1 An alternative definition is Tvj Tamb P Rth vj a where Rth vj a is a fixed value to be used for the calculation of Tvj The rating for Tvj limits the allowable combinations of powe...

Страница 3: ...umber Package Name Description Version TJA1055T SO14 plastic small outline package 14 leads body width 3 9 mm SOT108 1 TJA1055T 3 1 For TJA1055T 3 current source to GND for TJA1055T pull up resistor t...

Страница 4: ...in normal operating mode when a bus failure is detected active LOW in standby and sleep mode when a wake up is detected active LOW in power on standby when a VBAT power on event is detected STB 5 stan...

Страница 5: ...hus blocking the entire network communication due to a situation in which pin TXD is permanently forced to a LOW level caused by a hardware and or software application failure If the duration of the L...

Страница 6: ...essive threshold level for a certain period of time reception and transmission switch back to the differential mode If any of the wiring failure occurs the output signal on pin ERR will be set to LOW...

Страница 7: ...ERR to VCC in the unpowered state 3 For TJA1055T 3 ERR and RXD are open drain 4 In case the goto sleep command was used before When VCC drops pin EN will become LOW but due to the fail safe functiona...

Страница 8: ...uccessfully To enter a successful goto sleep command under all conditions this command must be kept stable for the maximum specified td sleep Pin INH will be set to a HIGH level again by the following...

Страница 9: ...4 Transitions to normal mode clear the internal wake up wake up interrupt flag and power on flag are cleared 5 Transitions to sleep mode pin INH is deactivated Fig 3 Mode control mbk949 POWER ON STAND...

Страница 10: ...resistor 6 The ESD performance of pins CANH CANL RTH and RTL with respect to GND was verified by an external test house in accordance with IEC 61000 4 2 C 150 pF R 330 The results were equal to or bet...

Страница 11: ...ditions Min Typ Max Unit Supplies pins VCC and BAT VCC supply voltage 4 75 5 25 V VCC stb supply voltage for forced standby mode fail safe 3 1 4 5 V ICC supply current normal operating mode VTXD VCC r...

Страница 12: ...100 A VCC 1 1 VCC 0 7 VCC 0 4 V on pin RXD IO 100 A VCC 1 1 VCC 0 7 VCC 0 4 V VOL LOW level output voltage IO 1 6 mA 0 0 4 V IO 1 2 mA VCC 4 75 V 0 0 4 V IO 5 mA 0 1 5 V Pins RXD and ERR TJA1055T 3 I...

Страница 13: ...VCC 5 V 6 6 7 2 7 8 V VCC 4 75 V to 5 25 V 1 32VCC 1 44VCC 1 56VCC V Vth wake wake up threshold voltage on pin CANL low power modes 2 5 3 2 3 9 V on pin CANH low power modes 1 1 1 8 2 5 V Vth wake dif...

Страница 14: ...acteristics continued VCC 4 75 V to 5 25 V VBAT 5 0 V to 40 V VSTB VCC Tvj 40 C to 150 C all voltages are defined with respect to ground positive currents flow into the device unless otherwise specifi...

Страница 15: ...VBAT 14 V for wake up after receiving a falling or rising edge 2 7 38 s tdet failure detection time normal operating mode failures 3 and 3a 1 6 8 0 ms failures 4 6 and 7 0 3 1 6 ms low power modes VB...

Страница 16: ...V to VCC VTXD VCANL VCANH VCAN VRXD tPD L tPD H VTXD is a rectangular signal of 50 kHz with 50 duty cycle and slope time 10 ns Termination resistors RCAN_L and RCAN_H 125 are not connected to pin RTL...

Страница 17: ...r testing purposes because the minimum load allowed on the CAN bus lines is 500 per transceiver Fig 6 Test circuit for dynamic characteristics TJA1055T 3 For more information refer to the separate FTC...

Страница 18: ...n This product has been qualified in accordance with the Automotive Electronics Council AEC standard Q100 Rev G Failure mechanism based stress test qualification for integrated circuits and is suitabl...

Страница 19: ...45 1 25 0 25 0 49 0 36 0 25 0 19 8 75 8 55 4 0 3 8 1 27 6 2 5 8 0 7 0 6 0 7 0 3 8 0 o o 0 25 0 1 DIMENSIONS inch dimensions are derived from the original mm dimensions Note 1 Plastic or metal protrusi...

Страница 20: ...r coming from a standing wave of liquid solder The wave soldering process is suitable for the following Through hole components Leaded or leadless SMDs which are glued to the surface of the printed ci...

Страница 21: ...to the peak temperature and cooling down It is imperative that the peak temperature is high enough for the solder to make reliable solder joints a solder paste characteristic In addition the peak temp...

Страница 22: ...was verified by an external test house in accordance with IEC 61000 4 2 C 150 pF R 330 The results were equal to or better than 6 kV for TJA1055 and equal to or better than 1 5 kV for TJA1054A MSL Mo...

Страница 23: ...al information Section 17 updated Table 1 Table 6 measurement conditions changed for parameters VCANH and VCANL Table 6 Table note 2 added Fig 7 and Fig 8 deleted Table 8 parameter Isup tot deleted pa...

Страница 24: ...ied prior to the publication hereof Suitability for use in automotive applications This NXP Semiconductors product has been qualified for use in automotive applications Unless otherwise agreed in writ...

Страница 25: ...bject to export control regulations Export might require a prior authorization from competent authorities Quick reference data The Quick reference data is an extract of the product data given in the L...

Страница 26: ...s 2 3 Quick reference data 2 4 Ordering information 3 5 Block diagram 3 6 Pinning information 4 6 1 Pinning 4 6 2 Pin description 4 7 Functional description 5 7 1 Failure detector 5 7 2 Low power mode...

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