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TDA5051A

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 5 — 13 January 2011

23 of 29

NXP Semiconductors

TDA5051A

Home automation modem

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in

JESD625-A

or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note

AN10365 “Surface mount reflow

soldering description”

.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.

16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:

•

Through-hole components

•

Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•

Board specifications, including the board finish, solder masks and vias

•

Package footprints, including solder thieves and orientation

•

The moisture sensitivity level of the packages

•

Package placement

•

Inspection and repair

•

Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

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Содержание TDA5051A

Страница 1: ...jection of aliasing components Fully integrated output power stage with overload protection Automatic Gain Control AGC at receiver input 8 bit A D Analog to Digital converter and narrow digital filtering Digital demodulation delivering baseband data Easy compliance with EN50065 1 with simple coupling network Few external components for low cost applications SO16 plastic package 3 Applications Home...

Страница 2: ...diagrams Figure 19 and Figure 20 5 Ordering information Table 1 Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage 4 75 5 0 5 25 V IDD tot total supply current fosc 8 48 MHz Reception mode 28 38 mA Transmission mode DATA_IN 0 ZL 30 Ω 1 47 68 mA Power down mode 19 25 mA fcr carrier frequency 2 132 5 kHz fosc oscillator frequency 6 08 9 504 MHz Vo rms output carrier...

Страница 3: ...automation modem 6 Block diagram Fig 1 Block diagram 002aaf038 1 4 7 DGND 5 AGND 12 VDDA VDDAP TX_OUT RX_IN APGND PD 13 VDDD 3 11 10 9 15 14 8 2 8 U H L D 16 ROM DAC clock filter clock OSCILLATOR DATA_OUT OSC2 OSC1 DIGITAL DEMODULATOR DIGITAL BAND PASS FILTER 2 CONTROL LOGIC D A modulated carrier TDA5051A A D TEST1 SCANTEST U D COUNT PEAK DETECT POWER DRIVE WITH PROTECTION 6 DATA_IN CLK_OUT 5 10 6...

Страница 4: ...f039 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 Table 3 Pin description Symbol Pin Description DATA_IN 1 digital data input active LOW DATA_OUT 2 digital data output active LOW VDDD 3 digital supply voltage CLK_OUT 4 clock output DGND 5 digital ground SCANTEST 6 test input LOW in application OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TX_OUT 10 analog sig...

Страница 5: ...testable Two digital inputs SCANTEST and TEST1 are used for production test these pins must be left open circuit in functional mode correct levels are internally defined by pull up or pull down resistors 8 1 Transmission mode To provide strict stability with respect to environmental conditions the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller cl...

Страница 6: ...current applications After digital demodulation the baseband data signal is made available after pulse shaping The signal pin RX_IN is a high impedance input which has to be protected and DC decoupled for the same reasons as with pin TX_OUT The high sensitivity 82 dBμV of this input requires an efficient 50 Hz rejection filter realized by the LC coupling network which also acts as an anti aliasing...

Страница 7: ...Parameter Conditions Min Typ Max Unit Supply VDD supply voltage 4 75 5 5 25 V IDD tot total supply current fosc 8 48 MHz Reception mode 28 38 mA Transmission mode DATA_IN 0 ZL 30 Ω 1 47 68 mA Power down mode 19 25 mA IDD RX TX tot total analog digital supply current VDD 5 V 5 Transmission or Reception mode 28 38 mA IDD PD tot total analog digital supply current VDD 5 V 5 PD HIGH Power down mode 19...

Страница 8: ...e shaped burst fosc 8 48 MHz see Figure 8 170 μs th hold time of the shaped burst fosc 8 48 MHz see Figure 8 170 μs tW DI min minimum pulse width of DATA_IN signal fosc 8 48 MHz see Figure 8 190 μs Vo rms output carrier signal RMS value DATA_IN LOW ZL CISPR16 120 122 dBμV Io max power amplifier maximum output current peak value DATA_IN LOW ZL 1 Ω 160 mA Zo output impedance of the power amplifier 5...

Страница 9: ...odulation delay hold time fosc 8 48 MHz see Figure 21 420 470 μs Bdet detection bandwidth fosc 8 48 MHz 3 kHz BER bit error rate fosc 8 48 MHz 600 baud S N 35 dB signal 76 dBμV see Figure 23 1 1 10 4 Power up timing td pu TX delay between power up and DATA_IN in transmission mode XTAL 8 48 MHz C1 C2 27 pF Rp 2 2 MΩ see Figure 10 1 μs td pu RX delay between power up and DATA_OUT in reception mode X...

Страница 10: ... the CISPR16 network provides an attenuation of 6 dB so the signal amplitude is 121 dBμV RMS Fig 3 Carrier spectrum Resolution bandwidth 100 Hz B 20dB 3000 Hz 2 1500 Hz Fig 4 Shaped signal spectrum Fig 5 AGC time constant definition not to scale 002aaf054 f Hz 105 106 60 40 80 20 0 Vo rms dBV 100 132 5 kHz f kHz 117 5 147 5 002aaf057 40 30 50 20 10 dBV RMS 60 132 5 20 dB 1500 Hz 002aaf058 VRXIN V ...

Страница 11: ...0 MHz to 4 752 MHz C1 C2 27 pF to 47 pF Rp 2 2 MΩ to 4 7 MΩ XTAL standard quartz crystal Table 7 Calculation of parameters depending on the clock frequency Symbol Parameter Conditions Unit fosc oscillator frequency with on chip oscillator frequency of the crystal quartz Hz with external clock frequency of the signal applied at OSC1 Hz fCLKOUT clock output frequency 1 2fosc Hz fcr carrier frequency...

Страница 12: ...demodulation hold time 3800 fosc max s 1 tW DI tW DI min 2 tW DI min tsu 1 fcr 3 tW DI min tsu wrong operation Fig 8 Relationship between DATA_IN and TX_OUT see Table 8 Table 8 Relationship between DATA_IN and TX_OUT X don t care PD DATA_IN TX_OUT 1 X high impedance 0 1 high impedance after th 0 0 active with DC offset Fig 9 Pulse shape characteristics Table 7 Calculation of parameters depending o...

Страница 13: ...t be HIGH before starting a transmission Fig 10 Timing diagram during power up in Transmission mode Fig 11 Timing diagram during power up in Reception mode Fig 12 Power down sequence in Transmission mode 002aaf046 td pu TX TX_OUT DATA_IN 1 VDD 90 VDD CLK_OUT HIGH not defined clock stable 002aaf047 td pu RX td dem h RX_IN DATA_OUT VDD 90 VDD CLK_OUT HIGH not defined not defined clock stable 002aaf0...

Страница 14: ...ta sheet Rev 5 13 January 2011 14 of 29 NXP Semiconductors TDA5051A Home automation modem Fig 13 Power down sequence in Reception mode Fig 14 Power saving by dynamic control of power down 002aaf049 td dem su td pd RX td pd RX DATA_OUT delayed by PD DATA_OUT RX_IN PD 002aaf050 tactive min IDD RX IDD PD IDD T DATA_OUT RX_IN PD 0 ...

Страница 15: ...MHz standard crystal Fig 15 Application diagram without power line insulation 250 V AC max T 630 mA 1 mH 68 Ω 2 W 47 nF X2 250 V AC 47 μH low RS MOV 250 V AC 47 nF 63 V 47 μH 100 μF 16 V 470 μF 16 V 7V5 1 3 W 1N4006 1N4006 2 μF 250 V AC 10 nF VDDD VDDAP APGND AGND DGND VDDA RX_IN TX_OUT SA5 0A 1 μF 16 V 14 1 5 V 5 V 2 MICRO CONTROLLER 4 7 OSC1 XTAL 7 3728 MHz 2 2 MΩ OSC2 8 5 9 12 3 3 1 2 13 11 15 ...

Страница 16: ... impedance fcr 115 2 kHz L 47 μH C 47 nF Main features of the coupling network 50 Hz rejection 80 dB anti aliasing for the digital filter 50 dB at the sampling frequency 1 2fosc Input impedance always higher than 10 Ω within the 95 kHz to 148 5 kHz band Fig 16 Gain a and input impedance b of the coupling network 002aaf055 f Hz 10 107 106 105 102 104 103 60 20 20 G dB 100 002aaf431 f Hz 10 107 106 ...

Страница 17: ...Hz standard crystal Fig 18 Application diagram with power line insulation 002aaf056 Zline Ω 1 102 10 110 120 130 Vo dBμV 100 250 V AC max T 630 mA 100 Ω 0 5 W 470 nF X2 250 V AC 47 μH low RS MOV 250 V AC 100 nF 22 μH 100 μF 16 V 470 μF 16 V 10 nF VDDD VDDAP APGND AGND DGND VDDA RX_IN TX_OUT SA5 0A 1 μF 16 V 14 1 5 V 5 V 2 MICRO CONTROLLER 4 7 OSC1 XTAL 7 3728 MHz 2 2 MΩ OSC2 8 5 9 12 3 3 1 2 13 11...

Страница 18: ...hout power line insulation with improved sensitivity 68 dBμV typ 250 V AC max T 630 mA 1 mH 68 Ω 2 W 47 nF X2 250 V AC 47 μH low RS MOV 250 V AC 47 nF 63 V 47 μH 100 μF 16 V 470 μF 16 V 7V5 1 3 W 1N4006 1N4006 2 μF 250 V AC 10 nF VDDD VDDAP APGND AGND DGND VDDA RX_IN TX_OUT SA5 0A 1 μF 16 V 14 1 5 V 5 V 2 MICRO CONTROLLER 4 7 OSC1 XTAL 7 3728 MHz 2 2 MΩ OSC2 8 5 9 12 3 3 1 2 13 11 15 47 nF 78L05 P...

Страница 19: ...line insulation with improved sensitivity 68 dBμV typ 250 V AC max T 630 mA 100 Ω 0 5 W 470 nF X2 250 V AC 47 μH low RS MOV 250 V AC 100 nF 22 μH 100 μF 16 V 470 μF 16 V 10 nF VDDD VDDAP APGND AGND DGND VDDA RX_IN TX_OUT 1 μF 16 V 14 1 5 V 5 V 2 MICRO CONTROLLER 4 7 OSC1 XTAL 7 3728 MHz 2 2 MΩ OSC2 8 5 9 12 3 3 1 2 13 11 15 47 nF 78L05 PD 27 pF 27 pF 10 DATA_IN DATA_OUT CLK_OUT TDA5051A 002aaf062 ...

Страница 20: ...asuring THD and bandwidth of the TX_OUT signal 30 Ω 1 μF 10 nF XTAL DATA_IN DATA_OUT td dem su td dem h DATA_OUT DATA_IN TX_OUT RX_IN OSCILLOSCOPE Y1 TDA5051A to be tested pulse generator 300 Hz 50 Y2 TX_OUT RX_IN fosc 2 1 10 14 7 8 002aaf051 G 002aaf052 TDA5051A POWER SUPPLY SPECTRUM ANALYZER 50 Ω 10 7 8 OSC1 OSC2 12 5 9 1 13 3 11 TX_OUT AGND DGND APGND VDDA VDDD VDDAP 5 Ω 50 Ω 10 μF 33 nF 250 nF...

Страница 21: ...Test set up for measuring Bit Error Rate BER 002aaf053 TDA5051A to be tested COUPLING NETWORK 1 V24 TTL INTERFACE 7 8 7 8 14 2 DATA_OUT DATA_IN RX_IN out TDA5051A SPECTRUM ANALYZER 50 Ω WHITE NOISE GENERATOR 10 12 5 9 12 5 9 1 OSC1 OSC2 OSC1 OSC2 TX_OUT in AGND DGND APGND AGND DGND APGND V24 SERIAL DATA ANALYZER PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE 29 1 BITS LONG DATA_IN DATA_OUT RXD TXD XTA...

Страница 22: ... 0 49 0 36 0 32 0 23 10 5 10 1 7 6 7 4 1 27 10 65 10 00 1 1 1 0 0 9 0 4 8 0 o o 0 25 0 1 DIMENSIONS inch dimensions are derived from the original mm dimensions Note 1 Plastic or metal protrusions of 0 15 mm 0 006 inch maximum per side are not included 1 1 0 4 SOT162 1 8 16 w M bp D detail X Z e 9 1 y 0 25 075E03 MS 013 pin 1 index 0 1 0 012 0 004 0 096 0 089 0 019 0 014 0 013 0 009 0 41 0 40 0 30 ...

Страница 23: ...r fine pitch SMDs Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization 16 2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder The wave soldering process is suitable for the following Through hole components Leaded or leadless SMDs which are glued...

Страница 24: ...omponents on one board Reflow temperature profile this profile includes preheat reflow in which the board is heated to the peak temperature and cooling down It is imperative that the peak temperature is high enough for the solder to make reliable solder joints a solder paste characteristic In addition the peak temperature must be low enough that the packages and or boards are not damaged The peak ...

Страница 25: ...e profiles for large and small components 001aac844 temperature time minimum peak temperature minimum soldering temperature maximum peak temperature MSL limit damage level peak temperature Table 11 Abbreviations Acronym Description ADC Analog to Digital Converter AGC Automatic Gain Control ASK Amplitude Shift Keying CMOS Complementary Metal Oxide Semiconductor DAC Digital to Analog Converter HF Hi...

Страница 26: ... Table 1 Quick reference data Tamb ambient temperature Min value changed from 10 C to 50 C Max value changed from 80 C to 100 C Table 4 Limiting values Tamb ambient temperature Min value changed from 10 C to 50 C Max value changed from 80 C to 100 C Table 5 Characteristics descriptive line below title is changed from Tamb 0 C to 70 C to Tamb 40 C to 85 C TDA5051A v 4 20100701 Product data sheet TD...

Страница 27: ...ons where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications tha...

Страница 28: ... automotive equipment or applications In the event that customer uses the product for design in and use in automotive applications to automotive specifications and standards customer a shall use the product without NXP Semiconductors warranty of the product for such automotive applications use and specifications and b whenever customer uses the product for automotive applications beyond NXP Semico...

Страница 29: ...nning information 4 7 1 Pinning 4 7 2 Pin description 4 8 Functional description 5 8 1 Transmission mode 5 8 2 Reception mode 6 8 3 Data format 6 8 3 1 Transmission mode 6 8 3 2 Reception mode 6 8 4 Power down mode 6 9 Limiting values 7 10 Characteristics 7 11 Timing 11 11 1 Configuration for clock 11 11 2 Timing diagrams 13 12 Application information 15 13 Test information 20 14 Package outline 2...

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