NXP Semiconductors
AH1721
SJA1105SMBEVM UM
AH1721
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© NXP Semiconductors N.V. 2018. All rights reserved.
User Manual
Rev. 1.00
— 16 July 2018
23 of 35
6. Example project software
6.1 Components and Layers
Fig 15. Software components and layers
The example project consists of the following components and layers (refer to Fig 15,
bottom to top):
•
Board HW components, like the various PHYs, the CAN-Transceiver, the switches,
etc. These are components which need a device driver to control the component’s
features.
•
The board HW components are connected to peripherals in the µC, which are, for
example, implementing a communication interface (UART, SPI, xMII, SMI, etc.) or
simply GPIOs. For simplicity, the GPIOs are not drawn in Fig 15, but they control
LEDs, reset and enable lines of those on-board HW components.
The uC ENET peripheral has an MII(Lite)-Interface for ethernet data, but also a SMI
interface for accessing the PHYs.
•
The next upper layer contains the SW components, which come with S32DS’s SDK:
SDK components are for example:
o
device drivers for the µC peripherals, e.g. SPI, clock, ADC, CAN, UART,
GPIO, etc.
o
device drivers for classes of peripherals outside the of the µC: For example,
the PHY device driver handles generic PHYs (like the GBit and FE copper
PHYs) but also special PHYs, like the TJA110x family. This driver uses the