NXP Semiconductors
UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
3.2 Required equipment
The kit requires the following equipment:
•
Compatible P6 SiC module
•
DC link capacitor compatible with the SiC module
•
30 µH to 50 µH, high current air core inductor for double pulse testing
•
HV power supply with protection shield and hearing protection
•
25 V, 1.0 A DC power supply
•
500 MHz 2.5 GS/s 4-channel oscilloscope
•
Rogowski coil, PEM Model CWT Mini HF60R, or CTW MiniHF30 (smaller diameter)
•
Isolated high-voltage probe (CAL Test Electric CT2593-1, LeCroy AP030)
•
Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•
Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160HB8EVM is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and the GD3160 gate drivers. The evaluation kit can be
connected to a compatible insulated gate bipolar transistor (IGBT) or SiC module for
half-bridge evaluations and applications development.
4.2 Board features
•
Capability to connect to P6 SiC module for half-bridge evaluations
•
Negative VEE gate low drive level (−3.9 V DC)
•
VCCREG regulated high gate drive level (+15 V DC)
•
Jumper configurable for disabling dead time fault protection when short-circuit testing
•
Easy access power, ground, and signal test points
•
Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•
DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•
Negative temperature coefficient (NTC) connection and configurable for monitoring
module temperature
UM11777
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© NXP B.V. 2022. All rights reserved.
User manual
Rev. 1 — 6 May 2022
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