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Table 2-12. POR configuration through switches
(continued)
SW2[5:6]
cfg_svr[0:1]
IFC_A[16:17]
Reserved
Reserved
SW2[7]
cfg_dram_type
IFC_A21
DRAM type selection
0: DDR4(1.2V)
1: DDR3L(1.35V)
SW2[8]
cfg_rsp_dis
IFC_AVD
Reserved
Reserved
SW3[1]
cfg_eng_use0
IFC_WE0
Sys_clock selection
0: differential sys_clk is
selected
1:single sys_clk is
selected
SW3[2:3]
cfg_eng_use[1:2]
Reserved
Reserved
Reserved
SW3[4]
BOOT_FLASH_SEL
-
Boot flash selection
0: NOR Flash
SW3[5:7]
CFG_VBANK[0:2]
-
Flash bank select
0: Default
SW3[8]
TEST_SEL_N
TEST_SEL_B
-
0: T1020
1: T1040
1. For SW3[4] : BOOT_FLASH_SEL, it can act as boot flash selection. When BOOT_FLASH_SEL=0, NOR Flash is boot
flash, when BOOT_FLASH_SEL=1, NAND Flash is boot flash.
2. SW3[5:7] can be used to change the staring address for the memory banks. For example, the NOR FLASH memory is
divided into eight memory banks with 16MB size each. Eight different U-Boot image can be programmed into each
memory bank, though normally only settings for bank 0 and bank 4 are used. When NOR FLASH is selected as boot flash
(CS0 is connected to NOR FLASH by setting SW3[4] to ON, RCW[0:8] is set to 0_0111_xxxx using SW1[1:8] and SW2[1]),
a different U-Boot image can be selected to boot up the board, by setting SW3[5:7].
For other boot sources configured by the DIP switch, see the QorIQ T1040 Reference Manual (T1040RM).
DIP switch definition
QorIQ T1040 Reference Design Board User Guide, Rev. 0, 06/2015
40
Freescale Semiconductor, Inc.
Содержание QorIQ T1040
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