NXP Semiconductors KE15Z, Руководство пользователя

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© 2016 NXP B.V.
KE15Z Touch Sensing Interface
1. Introduction
The purpose of this document is to explain the new TSI
(Touch Sensing Interface) measurement and how to
develop the software and hardware board from the
application point of view.
2. TSI Methods
Touch sensing interface (TSI) provides touch sensing
detection on capacitive touch sensors. The external
capacitive touch sensor is typically formed on PCB and
the sensor electrodes are connected to TSI input
channels through the I/O pins in the device.
KE15Z TSI supports 2 kinds of touch sensing methods,
the self-capacitive mode and the mutual-capacitive
mode, as showing in the figure below.
Figure 1 shows
the self-capacitive mode, and Figure 2 shows the
mutual-capacitive mode.
NXP Semiconductors
Document Number: KE15ZTSIUG
User's Guide
Rev. 0 , 12/2016
Contents
1. Introduction ........................................................................ 1
2. TSI Methods ....................................................................... 1
2.1. Self-capacitive mode ............................................... 2
2.2. Mutual-capacitive mode .......................................... 5
3. TSI software configurations ................................................ 7
3.1. Self-capacitive mode configurations ........................ 7
3.2. Mutual capacitive mode configurations ................. 14
3.3. Q&A for software configurations .......................... 17
4. Hardware design guide ..................................................... 18
4.1. Electrode shapes .................................................... 18
4.2. PCB trace routing .................................................. 19
4.3. Ground plane ......................................................... 20
4.4. Electrodes placement ............................................. 21
4.5. Hardware checklist ................................................ 21
5. References ........................................................................ 22
6. Revision history ................................................................ 22