2001 Nov 14
5
NXP Semiconductors
Product specification
860 MHz, 17 dB gain push-pull amplifier
BGX885N
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
DIMENSIONS (mm are the original dimensions)
SOT115D
0
5
10 mm
scale
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads
SOT115D
D
U1
q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
7
8
9
2
3
W
e
e1
5
6
4
p
y
M
B
x
M
B
1
B
04-02-04
10-06-18
q2
y
M
B
UNIT
A2
max.
c
e
e1
q
Q
max.
q1
q2
U2
U1
W
mm
20.8
9.5
0.51
0.38
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4
38.1 25.4 10.2 4.2
44.75
44.25
8.2
7.8
0.25
0.1
3.8
b
F
p
6-32
UNC
y
w
0.7
x
S
A
max.
D
max.
L
min.
E
max.
Z
max.
d
max.