
AN11524
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© NXP Semiconductors N.V. 2015. All rights reserved.
Application note
Rev. 1 — 17 February 2015
10 of 54
NXP Semiconductors
AN11524
NXQ1TXA6 Evaluation Board
4. NXP product offering
The NXQ1TXA6 evaluation board was designed based on the NXP products listed in
. The part numbers are hyperlinked to the NXP website to provide quick access to
product information and data sheets.
Table 2.
NXP components for wireless charger application
Type number
Function
Package
Ordering
information
Version
Description
12NC
Wireless charger
controller
SOT865
HVQFN: plastic thermal enhanced very thin
quad flat package; no leads; 33 terminals;
body 7
7
0.85 mm
9353 039 36551
Half-bridge level-shift
controller IC
SOT96
plastic small outline package; 8 leads; body
width 3.9 mm
9353 021 87518
30 V, single N-channel
Trench MOSFET
SOT323
plastic surface-mounted package; 3 leads
9340 656 35115
30 V, single N-channel
Trench MOSFET
SOT1220 plastic thermal enhanced ultra thin small
outline package; no leads; 6 terminals
9340 682 45115
High-voltage switching
diodes
SOT23
plastic surface-mounted package; 3 leads
9335 020 40215
Schottky barrier diodes
SOT23
plastic surface-mounted package; 3 leads
9339 763 80215
Adjustable precision
shunt regulator
SOT23
plastic surface-mounted package; 3 leads
9352 932 76215
Optional
NTAG-I2C NFC forum
type 2 Tag compliant IC
with I
2
C interface
SOT902
plastic extremely thin quad flat package; no
leads; 8 terminals
9353 028 43125
30 V complementary N/P
channel Trench
MOSFET
SOT363
plastic surface-mounted package with
increased, 6 leads
9340 682 44115
30 V, single P-channel
Trench MOSFET
SOT1220 plastic thermal enhanced ultra thin small
outline package; no leads; 6 terminals
9340 656 39115
Schottky barrier (double)
diodes
SOT23
plastic surface-mounted package; 3 leads
9339 763 70215
LDO (or use DC-to-DC
RT8295A)
SOT223
plastic surface-mounted package with
increased heatsink; 4 leads
9352 629 68135
12 W HV start-up fly
back controller (SMPS)
SOT96
plastic surface-mounted package; 8 leads
9353 026 97118