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Figure 4-2 Example of a POOR RF Thermal Relief
If thermal relief is necessary, use short, fat traces. This will still provide a solderable
connection, while providing a better RF connection. Making the traces shorter also allows for a
more continuous ground plane due to less copper being removed from the area. We also
recommend that you have ground vias around all thermal relief of critical ground pins such as
the five cellular shield tabs.
Содержание HS 3001
Страница 1: ...CNN0301IG001 HS 3001 Integration Guide Version 1 04 01 July 2013 ...
Страница 15: ... xiv USB Driver Installation Windows 7 48 ...
Страница 16: ... 1 1 Introduction Technical Specifications Reference Documents Typical Usage Contacting Novatel Wireless M2M ...
Страница 21: ... 6 2 Module Power Operating Power ...
Страница 25: ... 10 Figure 3 2 Host Board Layout ...
Страница 26: ... 11 Figure 3 3 Host Pads for Board To Board RF Connector ...
Страница 42: ... 27 Audio Schematics ...
Страница 43: ... 28 Figure 4 6 Audio Reference Design Schematic ...
Страница 56: ... 41 5 USB Driver Installation USB Driver Installation Windows XP USB Driver Installation Windows 7 ...
Страница 70: ... 55 Figure 5 18 Novatel Wireless M2M Driver Setup Utility Attached Devices Window ...