Nokia NKC-1X Series, Техническая документация инструкция

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NKC-1X
System Module CCS Technical Documentation
Page 24
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Nokia Corporation Issue 1 02/03
Test Interfaces
Production Test Pattern
The interface for NKC-1X production testing is a 5pin pad layout in the BB area (see the
figure below). The production tester connects to these pads by using spring connectors.
The interface includes the MBUS, FBUSRX, FBUSTX, VPP and GND signals. The pad size is
1.7mm. The same pads are used also for AS test equipment, such as the module jig and
the service battery.
Figure 9: Top View of Production Test Pattern
Other Test Points
As BB asics and flash memory are CSP components, the visibility of BB signals is very
poor. This makes the measuring of most of the BB signals impossible. In order to debug
the BB, at least to some level, the most important signals can be accessed from the
0.6mm test points. The figure below shows the test points located between the UEM and
the UPP. There is an opening in the baseband shield to provide access to these pads.
Figure 10: Test points Located Between UEM and UPP
3. FBUS_RX
8. GND 6. VPP
7.
MBUS
2. FBUS_TX
J 4 1 4
J 4 0 3
J 4 1 3
J 4 0 2
J 4 0 4
J 4 0 5
J 4 0 7
J 4 1 5
J 4 0 8
J 4 1 2
J 4 0 6
J 4 0 9
J 4 1 1
J 4 1 0
U E M (D 2 0 0 )
U P P ( D 4 0 0 )
P U R X S L E E P X
S L E E P C L K
U E M I N T
C B U S C L K C B U S D A C B U S E N X
M B U S T X M B U S R X
F B U S T X
F B U S R X
D B U S C L K D B U S D A
D B U S E N 1 X