Nokia 6310I - Cell Phone - GSM, Руководство по обслуживанию

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NPL-1
3 - Audio System PAMS Technical Documentation
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8 XMIC 2.0 2.2 k
Ω
Input AC impedance
1 Vpp Maximum signal level
0 1.55 V Mute (output DC level)
2.5 2.9 V Unmute (output DC level)
100 600
µ
A Bias current from UEM
2 Vpp
Microphone signal (Gain 0 dB)
Connected to UEM MIC3P + MIC2P input
9 SGND 330
Ω
Resistance to phone ground, return path
for XMIC. When the DLR-3 datacable is
connected, SGND swhiches to be a supply
line for the cable (2.8V)
10 XEAR 47
Ω
Output AC impedance (ref. LGND)
10
µ
F Series output capacitance
16 300
Ω
Load AC impedance to GND (Headset) pin
#14
4.7 10 k
Ω
Load AC impedance to GND (Accessory)
pin #14
1.0 Vpp Maximum output level (no load)
6.8 k
Ω
Load DC resistance to GND (Accessory)
pin #14
16 1500
Ω
Load DC resistance to GND (Headset) pin
#14
2.78 2.8 2.86 V DC voltage (47k pull-up to Vflash1)
HEAR 0 14 220 mV
Earphone signal
Connected to UEM HF output
11 MBUS
0
2.0
0.8
2.8
V Serial bi-directional control bus.
Baud rate 9600 Bit/s
Phone has 4.7k
Ω
pull up resistor in UEM
12 FBUS_R
X
0
2.0
0.8
2.8
V Fbus receive. Serial Data
Baud rate 9.6k-230.4kBit/s
Phone has 220k
Ω
pull down resistor
13 FBUS_TX
0.1
1.7
0.8
2.8
V Fbus transmit. Serial Data
Baud rate 9.6k-230.4kBit/s
Phone has 47k
Ω
pull up resistor in UEM
14 L-GND 0 0 V Supply ground
7DEOH
System connector pin assignment
Pin Name Min Typ Max Unit Notes