User’s Manual U14700EJ2V0UM
44
APPENDIX C CONNECTORS FOR TARGET CONNECTION
C.1 Usage
(1) When mounting NQPACK144SD on target system
<1>
Coat the tip of the four projections (points) at the bottom of the NQPACK144SD with two-component type
epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not
bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the
target system. If the lead of the NQPACK144SD is not aligned with the pad of the target system easily,
perform step <2> to adjust the position.
<2>
To adjust the position, insert the guide pins for position adjustment (NQGUIDE) provided with
NQPACK144SD into the pin holes on the upper side of NQPACK144SD (refer to Figure C-1).
The diameter of a hole is
φ
= 1.0 mm. There are three non-through holes (refer to
APPENDIX A
DIMENSIONS
).
<3>
After setting the HQPACK144SD, solder the NQPACK144SD to the target system. By following this
sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided.
Recommended soldering conditions… Reflow:
240
°
C, 20 seconds max.
Partial heating:
240
°
C, 10 seconds max. (per pin row)
<4>
Remove the guide pins.
Figure C-1. Mounting NQPACK144SD
Remark
NQPACK144SD: Connector for target connection
HQPACK144SD: Cover for device installation
NQPACK144SD
Guide pins
(NQGUIDE)
HQPACK144SD
Target system
Содержание IE-703116-MC-EM1
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