Table 27.1
T: Total spectrum; SW: 2–5 µm; LW: 8–14 µm, LLW: 6.5–20 µm; 1: Material; 2: Specification;
3:Temperature in °C; 4: Spectrum; 5: Emissivity: 6:Reference (continued)
1
2
3
4
5
6
Chipboard
untreated
20
SW
0.90
6
Chromium
polished
50
T
0.10
1
Chromium
polished
500–1000
T
0.28–0.38
1
Clay
fired
70
T
0.91
1
Cloth
black
20
T
0.98
1
Concrete
20
T
0.92
2
Concrete
dry
36
SW
0.95
7
Concrete
rough
17
SW
0.97
5
Concrete
walkway
5
LLW
0.974
8
Copper
commercial,
burnished
20
T
0.07
1
Copper
electrolytic, care-
fully polished
80
T
0.018
1
Copper
electrolytic,
polished
–34
T
0.006
4
Copper
molten
1100–1300
T
0.13–0.15
1
Copper
oxidized
50
T
0.6–0.7
1
Copper
oxidized to
blackness
T
0.88
1
Copper
oxidized, black
27
T
0.78
4
Copper
oxidized, heavily
20
T
0.78
2
Copper
polished
50–100
T
0.02
1
Copper
polished
100
T
0.03
2
Copper
polished,
commercial
27
T
0.03
4
Copper
polished,
mechanical
22
T
0.015
4
Copper
pure, carefully
prepared surface
22
T
0.008
4
Copper
scraped
27
T
0.07
4
Copper dioxide
powder
T
0.84
1
Copper oxide
red, powder
T
0.70
1
Ebonite
T
0.89
1
Emery
coarse
80
T
0.85
1
Enamel
20
T
0.9
1
Enamel
lacquer
20
T
0.85–0.95
1
Fiber board
hard, untreated
20
SW
0.85
6
Fiber board
masonite
70
SW
0.75
9
Fiber board
masonite
70
LW
0.88
9
Fiber board
particle board
70
SW
0.77
9
Fiber board
particle board
70
LW
0.89
9
Fiber board
porous, untreated
20
SW
0.85
6
Glass pane (float
glass)
non-coated
20
LW
0.97
14
Gold
polished
130
T
0.018
1
#T559950; r. AD/35720/35720; en-US
108
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