Mouser Electronics
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LLA219C70G475ME01L
LLA219C70G475ME01K
Страница 1: ...r General Electronic equipment 20 55 to 125 C 22 to 22 55 to 125 C 25 C 3 Temperature Characteristics Public STD Code F EIA p Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Ch...
Страница 2: ...a Termination should occur eutectic solder Then apply 5N force in parallel with the test jig for 10 1 sec The soldering shall be done either with an iron or using the reflow method and shall be conduc...
Страница 3: ...at 150 0 10 C for one houg and then let sit D F 0 2 max for 24 2 hours at room temperature Perform the initial measurement I R 12 5 F min Measurement after test Perform a heat treatment at 150 0 10 fo...
Страница 4: ...g Code L K 2 1 Minimum Quantity pcs reel 2 2 Dimensions of Tape in mm Package LLA Type 4 0 0 1 4 0 0 1 2 0 0 1 0 2 0 1 1 7max A B 1 75 0 1 3 5 0 05 8 0 0 3 1 5 Code LLA18 LLA21 LLA31 A 1 05 0 1 1 45 0...
Страница 5: ...0 5 10 1 5 16 5 max Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Top Tape Thickness 0 06 LLA18 LLA215 LLA315 type Thickness 0 05 Feeding Hole As specified in 2 2 Fig 1 Package Chip...
Страница 6: ...no jointing for top tape and bottom tape 2 9 There are no fuzz in the cavity 2 10 Break down force of top tape 5N min 2 11 Reel is made by resin and appeaser and dimension is shown in Fig 3 There are...
Страница 7: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...
Страница 8: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...
Страница 9: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...
Страница 10: ...s such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high di...
Страница 11: ...ny impact on the terminals 2 Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor Do not use a fallen capacitor because the quality and reliability m...
Страница 12: ...use capacitors that were removed from the equipment 2 Confirm capacitance characteristics under actual applied voltage 3 Confirm the mechanical stress under actual process and equipment use 4 Confirm...
Страница 13: ...nozzle so as not to bend the printed circuit board 2 Adjust the nozzle pressure within a static load of 1N to 3N during mounting Incorrect Correct 2 Dirt particles and dust accumulated between the suc...
Страница 14: ...flow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thi...
Страница 15: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...
Страница 16: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...
Страница 17: ...hat can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplug...
Страница 18: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...
Страница 19: ...and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact us...
Страница 20: ...ons in table 1 for flow soldering table 2 for reflow soldering Please confirm the suitable land dimension by evaluating of the actual SET PCB Table 2 Reflow Soldering Method Dimensions Part Number in...
Страница 21: ...ocess The stress is affected by the amount of resin and curing contraction Select a resin with small curing contraction The difference in the thermal expansion coefficient between a coating resin or a...
Страница 22: ...way that the boxes are not deformed and forces are not directly passed on to the inner packaging 1 2 Do not apply excessive vibration shock and pressure to the capacitor 1 When excessive mechanical sh...
Страница 23: ...ation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your...
Страница 24: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Murata LLA219C70G475ME01L LLA219C70G475ME01K...
