Recommended derating conditions on voltage and temperature
These Part Numvers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test with 100% × rated voltage
as testing voltage at the maximum operating temperature.
The following voltage and temperature derating conditions are
recommended for use to ensure the same reliability level as
normal specification.
Adhesive Strength of Termination, Vibration Resistance, Temperature Cycle, Humidity,
Test method : Deflection
Humidity Load, High Temperature Load, Resistance to Soldering Heat (Reflow method)
･
Test substrate
･
Test substrate
Material : Copper-clad laminated sheets for PCBs
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
(Coat with heat resistant resin for solder)
Fig.1
(in mm)
Fig.3
(in mm)
Fig.2
(in mm)
■
SPECIFICATIONS AND TEST METHODS
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
＊2
4.0±0.1
8.
0±
0.
3
3.5
±
0.
05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
100
40
a
c
b
Land
f
4.5
c
＊2
4.0±0.1
8.
0±
0.
3
3.5
±
0.
05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75
±
0.
1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f
4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20 50
Flexure:
≦
1
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
JEMCGS-00074C
5
