Temperature
Compensating Type
High Dielectric
Constant Type
11 Vibration
Appearance
No defects or abnormalities.
Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
Resistance
using a eutectic solder.
Capacitance
Within the specified tolerance.
The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly between
Q/D.F.
30pF and over:Q
≧
1000
［
R6,R7,C8,L8
］
the approximate limits of 10 and 55Hz.
30pF and beloow:Q
≧
400+20C W.V.:100V : 0.025max.(C
＜
0.068
m
F)
The frequency range, from 10 to 55Hz and return to 10Hz, should be
: 0.05max.(C
≧
0.068
m
F)
traversed in approximately 1 minute. This motion should be applied for
C:Nominal Capacitance(pF)
W.V.:50V/25V : 0.025max.
a period of 2 hours in each 3 mutually perpendicular directions
W.V.:16V/10V : 0.035max.
(total of 6 hours).
W.V.:6.3V/4V : 0.05max. (C
＜
3.3
m
F)
: 0.1max.(C
≧
3.3
m
F)
[R9]
W.V.:50V : 0.05max.
[E4]
W.V.:25V : 0.025max.
[F5]
W.V.:25Vmin : 0.05max. (C
＜
0.1
m
F)
: 0.09max.(C
≧
0.1
m
F)
W.V.:16V/10V : 0.125max.
W.V.:6.3V : 0.15max.
12 Deflection
Appearance
No defects or abnormalities.
Solder the capacitor on the test jig(glass epoxy board) shown in Fig.1
using an eutectic solder.
Capacitance
Within ±5% or± 0.5pF
Within ±10%
Then apply a force in the direction shown in Fig 2 for 5±1 seconds.
Change
(Whichever is larger)
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
13 Solderability
75% of the terminations is to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
of Termination
rosin (JIS-K-5902) (25% rosin in weight proportion) .
Preheat at 80 to 120
℃
for 10 to 30 seconds.
After preheating , immerse in an eutectic solder solution for
2±0.5 seconds at 230±5
℃
or Sn-3.0Ag-0.5Cu solder solution
for 2±0.5 seconds at 245±5
℃
.
14 Resistance to
The measured and observed characteristics should satisfy
<GRM03 size min.>
Soldering Heat
the specifications in the following table.
Preheat the capacitor at 120 to 150
℃
for 1 min.(GRM31 size max.)
Preheat the capacitor at 100 to 120
℃
for 1 min and
Appearance
No defects or abnormalities.
170 to 200
℃
for 1 min.(GRM32 size min.)
Capacitance
Within
±
2.5% or
±
0.25pF
R6,R7,R9,C8,L8 : Within
±
7.5%
Immerse the capacitor in an eutectic solder solution or
Change
(Whichever is larger)
E4,F5 : Within
±
20%
Sn-3.0Ag-0.5Cu solder solution at 270±5
℃
for 10±0.5 seconds.
Q/D.F.
30pF and over:Q
≧
1000
［
R6,R7,C8,L8
］
Set at room temperature for 24±2 hours, then measure.
30pF and beloow:Q
≧
400+20C W.V.:100V : 0.025max.(C
＜
0.068
m
F)
· Initial measurement for high dielectric constant type
: 0.05max.(C
≧
0.068
m
F)
Perform a heat treatment at 150+0/-10°C for one hour and then set
C:Nominal Capacitance(pF)
W.V.:50V/25V : 0.025max.
at room temperature for 24±2 hours.
W.V.:16V/10V : 0.035max.
Perform the initial measurement.
W.V.:6.3V/4V : 0.05max. (C
＜
3.3
m
F)
: 0.1max.(C
≧
3.3
m
F)
<GRM02 size only>
[R9]
Set the capacitor by reflow soldering on the glass epoxy PCB with
W.V.:50V : 0.05max.
Sn-3.0Ag-0.5Cu solder. Preheat the capacitor on the PCB at 120 to
[E4]
150
℃
for 1 minute by use of hot plate. Heat the capacitor on the
W.V.:25V : 0.025max.
PCB at 270±5
℃
for 10±0.5 seconds on the hot plate.
[F5]
Set at room temperature for 24±2 hours, then measure.
W.V.:25Vmin : 0.05max. (C
＜
0.1
m
F)
· Initial measurement for high dielectric constant type
: 0.09max.(C
≧
0.1
m
F)
Perform a heat treatment at 150+0/-10°C for one hour and then set
W.V.:16V/10V : 0.125max.
at room temperature for 24±2 hours.
W.V.:6.3V : 0.15max.
Perform the initial measurement.
I.R.
More than 10,000M
W
or 500
W
·F(Whichever is smaller)
Dielectric
No defects.
Strength
15 Temperature Cycle
The measured and observed characteristics should satisfy
Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
the specifications in the following table.
using an eutectic solder.
Perform the five cycles according to the four heat treatments shown
Appearance
No defects or abnormalities.
in the following table.
Set for 24±2 hours at room temperature, then measure.
Capacitance
Within
±
2.5% or
±
0.25pF
R6,R7,R9,C8,L8 : Within
±
7.5%
Change
(Whichever is larger)
E4,F5 : Within
±
20%
Q/D.F.
30pF and over:Q
≧
1000
［
R6,R7,C8,L8
］
30pF and beloow:Q
≧
400+20C W.V.:100V : 0.025max.(C
＜
0.068
m
F)
: 0.05max.(C
≧
0.068
m
F)
C:Nominal Capacitance(pF)
W.V.:50V/25V : 0.025max.
W.V.:16V/10V : 0.035max.
W.V.:6.3V/4V : 0.05max. (C
＜
3.3
m
F)
: 0.1max.(C
≧
3.3
m
F)
· Initial measurement for high dielectric constant type
[R9]
Perform a heat treatment at 150+0/-10
C for one hour and then set
W.V.:50V : 0.05max.
at room temperature for 24±2 hours.
[E4]
Perform the initial measurement.
W.V.:25V : 0.025max.
[F5]
W.V.:25Vmin : 0.05max. (C
＜
0.1
m
F)
: 0.09max.(C
≧
0.1
m
F)
W.V.:16V/10V : 0.125max.
W.V.:6.3V : 0.15max.
I.R.
More than 10,000M
W
or 500
W
·F(Whichever is smaller)
Dielectric
No defects.
Strength
■
SPECIFICATIONS AND TEST METHODS
No
Item
Specification
Test Method
Step
Temperature
Time
1
100
C to 120
C
1 min.
2
170
C to 200
C
1 min.
Step
Temp.(
C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
JEMCGS-00074C
3
