2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and
has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Part Number
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Part Number
(in mm)
Notice
Chip
（
L×W
）
a
b
c
0.8
～
1.1
GQM18
GQM21
1.6×0.8
0.6
～
1.0
1.9
～
2.3
Chip
（
L×W
）
a
b
c
2.0×1.25
1.0
～
1.2
0.6
～
0.7
0.8
～
1.1
1.6×0.8
0.8
～
0.9
0.6
～
0.8
1.0
～
1.2
GQM18
GQM21
0.6
～
0.8
GQM22
2.0×1.25
2.8×2.8
0.9
～
1.0
2.2
～
2.5
0.8
～
1.0
0.6
～
0.8
0.6
～
0.7
Chip Capacitor Lan
d
Solder Resist
a
b
C
JEMCNC-0012L
22
