Murata GCM1885C1H390FA16D 0603 Скачать руководство пользователя страница 27

6.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality
    and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
    electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.
 3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
        performance of the capacitors.

7.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
    curing process.
    The stress is affected by the amount of resin and curing contraction.
    Select a resin with small curing contraction.
    The difference in the thermal expansion coefficient between a coating resin or a molding resin and
    capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
    lead to the deterioration of insulation resistance or dielectric breakdown.
    Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
    A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.
    Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation 
    resistance of a capacitor.
    An epoxy resin can be used as a less hygroscopic resin.

 Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
        during transportation.

   (1) Climatic condition 
      

 low air temperature

:-

40

      

 change of temperature air/air

:-

25

/

25

      

 low air pressure

30 kPa

      

 change of air pressure

6 kPa/min

   (2) Mechanical condition 
        Transportation shall be done in such a way that the boxes are not deformed and forces are not directly
        passed on to the inner packaging.

 1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.

   (1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
        occur in the ceramic body of the capacitor.

   (2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the
        surface of capacitor, the capacitor may crack and short-circuit.

 1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
        The capacitor dropped accidentally during processing may be damaged.

Notice

JEMCGC-2702N

27

Содержание GCM1885C1H390FA16D 0603

Страница 1: ...1 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 C...

Страница 2: ...sistance The measured and observed characteristics should satisfy the Apply the 24 hour heat 25 to 65 and humidity 80 to 98 specifications in the following table treatment shown below 10 consecutive t...

Страница 3: ...perpendicular axes of the test specimen 18 shocks Change The specified test pulse should be Half sine and should have a Q D F 30pFmin Q 1000 R7 L8 W V 25Vmin 0 025 max duration 0 5ms peak value 1500g...

Страница 4: ...nd rosin JIS K 5902 25 rosin in weight propotion Immerse in eutectic solder solution for 5 0 0 5 seconds at 235 5 c should be placed into steam aging for 8 hours 15 minutes After preheating immerse th...

Страница 5: ...5max uniform and gree of defects such as heat shock C Nominal Capacitance pF R9 0 05max I R More than 10 000M or 500 F Whichever is smaller in mm 20 Beam Load Test Destruction value should be exceed f...

Страница 6: ...Temperature Within the specified tolerance 1 3 and 5 by the cap value in step 3 Coefficent Table A Capacitance Within 0 2 or 0 05 pF Drift Whichever is larger 2 High Dielectric Constant Type The rang...

Страница 7: ...10000 M 3000 10000 N 2000 8000 R D E 1000 4000 M 1000 5000 N R 1000 4000 E 500 2000 M 1000 5000 N R 1000 4000 1 2 Dimensions of Tape 1 GC 03 15 W8P2 CODE D E J F in mm Code GC 03 GC 15 A 3 0 37 0 65...

Страница 8: ...3 5 0 2 5 GC 43 55 in mm Code GC 43 GC 55 A 2 3 6 5 2 2 Nominal value B 2 4 9 6 1 Package GC Type 4 0 0 1 4 0 0 1 2 0 0 1 1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 1 1 max 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1...

Страница 9: ...ip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GC 32 max 16 5 max 10 1 5 GC 43 55 20 5 max 14 1 5 180 0 3 0 330 2 0 50 min 13 0 5 2 0...

Страница 10: ...9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is...

Страница 11: ...he following conditions Temperature of 5 to 40 and a Relative Humidity of 20 to 70 1 Sunlight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during...

Страница 12: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...

Страница 13: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Страница 14: ...such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high die...

Страница 15: ...re piled up or handled the corners of another printed circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mount...

Страница 16: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Страница 17: ...tions Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumula...

Страница 18: ...e to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to chips not listed in Table 2 Table 2 In case of repea...

Страница 19: ...n 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GC 03 15 18 the top of the solder fillet should be lower tha...

Страница 20: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Страница 21: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Страница 22: ...t can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugge...

Страница 23: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Страница 24: ...and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact u...

Страница 25: ...w Soldering Method Dimensions Part Number GC 31 3 2 1 6 2 2 2 6 1 0 1 1 1 0 1 4 in mm Table 2 Reflow Soldering Method Dimensions Part Number GC 31 3 2 1 6 2 2 2 4 0 8 0 9 1 0 1 4 GC 32 3 2 2 5 2 0 2 4...

Страница 26: ...rol curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of So...

Страница 27: ...n under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance...

Страница 28: ...n 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your tec...

Страница 29: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Murata GCM1885C1H390FA16J GCM1885C1H390FA16D...

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