Murata GCJ216R71E682KA01 Series Скачать руководство пользователя страница 22 | Manualshive

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Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet
height.

1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board.
Please contact us if you want to use our ceramic capacitors on a metal board such as Aluminum.

Pattern Forms

Lateral Mounting

Prohibited

Correct

Notice

Placing Close to Chassis

Placing of Chip

Components

and Leaded Components

Placing of Leaded

Components

after Chip Component

Chassis

Solder (ground)

Electrode Pattern

Lead Wire

Solder Resist

Solder Resist

Soldering Iron

Lead Wire

Solder Resist

Solder Resist

JEMCGC-4642B

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Содержание GCJ216R71E682KA01 Series

Страница 1: ... C 25 C 3 Temperature Characteristics Public STD Code X7R EIA Specifications and Test Methods Operating Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capacitance Tolerance 25 Vdc Only Reflow Soldering 0 7 min 2 T 0 6 0 1 This product specification is applied to Chip Monolithic Ceramic Capacitor Soft Termination Type used for Automotive Electronic equipment This product is applied for...

Страница 2: ...al Analysis 5 Moisture Resistance The measured and observed characteristics should satisfy the Apply the 24 hour heat 25 to 65 and humidity 80 to 98 specifications in the following table treatment shown below 10 consecutive times Appearance No marking defects Set for 24 2 hours at room temperature then measure Capacitance R1 R7 C7 Within 10 0 Change D F R1 R7 C7 0 05 max I R More than 10 000MΩ or ...

Страница 3: ...ce perpendicular axes of the test specimen 18 shocks Change The specified test pulse should be Half sine and should have a D F R1 R7 C7 0 05 max duration 0 5ms peak value 1500g and velocity change 4 7m s I R More than 10 000MΩ or 500Ω F Whichever is smaller 12 Vibration Appearance No marking defects Solder the capacitor to the test jig glass epoxy board in the same Capacitance Within the specified...

Страница 4: ...rse the capacitor in a solution of ethanol JIS K 8101 and rosin JIS K 5902 25 rosin in weight propotion Immerse in eutectic solder solution for 5 0 0 5 seconds at 235 5 c should be placed into steam aging for 8 hours 15 minutes After preheating immerse the capacitor in a solution of ethanol JIS K 8101 and rosin JIS K 5902 25 rosin in weight propotion Immerse in eutectic solder solution for 120 5 s...

Страница 5: ...N GCJ18 I R More than 10 000MΩ or 500Ω F Whichever is smaller in mm 20 Beam Load Test Destruction value should be exceed following one Place the capacitor in the beam load fixture as Fig 4 Chip L dimension 2 5mm max Apply a force Chip Length 2 5mm max Chip L dimension 3 2mm min Chip thickness 1 25mm rank 15N Chip thickness 1 25mm rank 54 5N Chip Length 3 2mm min Speed supplied the Stress Load 0 5m...

Страница 6: ...cified ranges 50 of the rated R1 Within 15 40 voltage for W V 50V max only Initial measurement for high dielectric constant type Perform a heat treatment at 150 0 10 for one hour and then set for 24 2 hours at room temperature Perform the initial measurement AEC Q200 Murata Standard Specification and Test Methods No AEC Q200 Test Item AEC Q200 Test Method Specification Step Temperature Applying Vo...

Страница 7: ... L Code F J Code K GCJ18 4000 10000 6 4000 10000 9 4000 10000 B 3000 10000 9 3000 10000 M 3000 10000 C 2000 6000 GCJ32 D E 1000 4000 1 2 Dimensions of Tape 1 GCJ18 21 in mm Code GCJ18 GCJ21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 Ｐａｃｋａｇe ＧＣＪＴｙｐｅ Type GCJ21 GCJ31 T 0 85 max 1 1 max 4 0 0 1 4 0 0 1 2 0 0 1 φ1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 ＡＢ b1 a1 JEMCGP 01896 7 ...

Страница 8: ... 45 0 2 1 9 0 2 2 8 0 2 B 2 25 0 2 3 5 0 2 3 5 0 2 Ｐａｃｋａｇe ＧＣＪＴｙｐｅ 4 4 1 7 max T 1 25mm 2 5 max T 1 35 1 6mm 3 0 max T 1 8 2 0mm 3 7 max T 2 5mm 0 25 0 1 T 1 80mm 0 3 0 1 T 2 5mm 4 0 0 1 1 75 0 1 4 0 0 1 8 0 0 3 3 5 0 05 ＡＢ 2 0 0 1 φ1 5 0 1 0 JEMCGP 01896 8 ...

Страница 9: ...n 2 2 Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Bottom Tape Thickness 0 05 Only a bottom tape existence W w1 GCJ32 max 16 5 max 10 1 5 φ180 0 3 0 φ330 2 0 φ50 min φ13 0 5 2 0 0 5 Chip in mm Fig 1 Package Chips Fig 2 Dimensions of Reel Fig 3 Taping Diagram JEMCGP 01896 9 ...

Страница 10: ...There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is shown in Fig 2 There are possibly to change the material and dimension due to some impairment 1 12 Peeling off force 0 1 to 0 6N in the direction as shown below 1 13 Label that show the customer parts n...

Страница 11: ...the following conditions Temperature of 5 to 40 and a Relative Humidity of 20 to 70 1 Sunlight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product within six months of receipt 2 Please confirm solderability before using after six months Store the capacitors w...

Страница 12: ...citors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measurement of Capacitance 1 Measure capacitance with the voltage and the frequency specified in the product specifications 1 1 The output voltage of the measuring e...

Страница 13: ... Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers The time duration until breakdown depends on the applied voltage and the ambient temperature 4 Applied Voltage and Self heating Temperature 1 When the capacitor is used in a hi...

Страница 14: ...s such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit AC voltage characteris...

Страница 15: ...are piled up or handled the corners of another printed circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board 1 1 Choose a mounting position t...

Страница 16: ...essive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending damage or cracking Please take into account the following precautions and recommendations for use in your process 1 Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit...

Страница 17: ...ons Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulated soldering time must be within the range shown above 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thick application of solder paste results in a excessive solder fillet height This makes t...

Страница 18: ...CBs 6 Electrical Test on Printed Circuit Board 1 Confirm position of the support pin or specific jig when inspecting the electrical performance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resulting in cracked chips or open solder joints Provide support pin...

Страница 19: ...jig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circuit board cropping machine is shown as follows Along the lines with the V grooves on printed circuit board the top and bottom blades are aligned to one another when cropping the board The misalignme...

Страница 20: ... that can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsened by supplying continuous power 2 In this type of situation do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitors h...

Страница 21: ... capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation 1 3 The deterioration of characteristics and insulation resistance due ...

Страница 22: ...s and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact us if you want to use our ceramic capacitors on a metal board such as Aluminum Pattern Forms Lateral Mounting Prohibited Correct Notice Placing Close to Chassis Placing of Chip Components and Leaded C...

Страница 23: ...ase confirm the suitable land dimension by evaluating of the actual SET PCB Table 1 Reflow Soldering Method Dimensions Part Number GC 31 3 2 1 6 2 2 2 4 0 8 0 9 1 0 1 4 GC 32 3 2 2 5 2 0 2 4 1 0 1 2 1 8 2 3 in mm 2 0 1 25 1 0 1 2 0 6 0 7 0 8 1 1 GC 18 GC 21 1 6 0 8 0 6 0 8 Notice a b 0 6 0 7 0 6 0 8 Chip L W c Chip Capacitor Land Solder Resist a b C JEMCGC 4642B 23 ...

Страница 24: ...an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance of a capacitor An epoxy resin can be used as a less hygroscopic resin Others 1 Transportation 1 The performance of a capacitor may be affected by the conditions during transportation 1 1 The capacito...

Страница 25: ...on 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your technical documents as above include such terms and conditions such as warranty clause product liability clause or intellectual property infringement liability clause they will be deemed to be invalid N...

Страница 26: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Murata GCJ216R71E682KA01J GCJ216R71E682KA01D ...

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