3.6 MODULE SOCKETS
3.6.1 MEMORY MODULE
3.6.1.1 Electrical And Mechanical Requirements
A 200 pin DDR667-SDRAM (PC5300) SO-DIMM socket with JEDEC standard layout is available for the system
memory. DDR667-SDRAM SO-DIMM memory modules with up to 2 GByte size (1GBit chips) can be mounted.
The memory modules listed bellow are tested and approved to work with the PIP. Regarding the special
environmental conditions the PIP is normally used, MPL AG recommends to use low power memory modules.
MPL AG does not recommend using low cost consumer memory modules.
It is the customers responsibility that memory modules supplied by third party vendors meet the above stated
requirements. MPL AG will not be liable for memory modules that are purchased from third party vendors and
don’t work in the PIP.
Module Manufacturer
Part Number
Chip Manufacturer
Capacity
Qimonda
HYS64T128021HDL–3–B
Qimonda
1024 MByte
Memphis
SODDD128M646G-D48EL
ProMOS
1024 MByte
Memphis
SODDD128M646-D48INV
ProMOS
1024 MByte
Memphis
SODDD256M646G-C18MT
ProMOS
2048 MByte
3.6.1.2 Mounting The Memory Module
Figure 47:
Mounting The Memory Module
3.6.2 RS232 AND RS485 / RS422 INTERFACE MODULES
The SERIAL2 and SERIAL4 interface can be equipped with MPL AGs SERIF Modules (optional). This modules
adds either RS232 or RS485 (half duplex) / RS422 (full duplex) support.
For more information please refer to the SERIF User Manual.
3.6.3 PC/104(-
PLUS
) MODULES
Please follow the appropriate module manuals for installing and setup the PC/104(-
PLUS
) modules.
3.6.4 PCI-EXPRESS MINI CARD MODULES
There is a PCI-Express Mini Card Slot with a SIM card slot to expand the PIP with different wireless interfaces
(like WLAN, GPRS, UMTS, ... ).
Please follow the appropriate module manuals for installing and setup the different wireless modules.
2010 by MPL AG
41
MEH-10126-201 Rev. D
High-Tech • Made in Switzerland
PIP20 / PIP22
Technical Reference Manual
