43
work for shorts due to solder bridges. When removing modules with
metal enclosures, be sure to desolder the enclosure ground tabs as well
as the module pins.
Flexible Circuits
The flexible circuits are made from a different material than the rigid
boards, and different techniques must be used when soldering.
Excessive prolonged heat on the flexible circuit can damage the
material. Avoid excessive heat and excessive bending. For parts
replacement, use the ST-1087 Temperature-Controlled Solder Station
with a 600 or 700 degree tip, and use small diameter solder such as ST-
633. The smaller size solder will melt faster and require less heat being
applied to the circuit.
To replace a component on a flexible circuit, grasp the edge of the
flexible circuit with seizers (hemostats) near the part to be removed,
and pull gently. Apply the tip of the soldering iron to the component
connections while pulling with the seizers. Do not attempt to puddle
out components. Prolonged application of heat may damage the
flexible circuit.
Specific
During all repair procedures, heating neighboring components can be
minimized by:
• using upper heat only.
• using the correct size heat-focus head, approximately the same size
as the carrier being replaced.
• keeping the heat focus head approximately 1/8” above the printed
circuit board when removing or replacing the device.
Strip Connector (P301/
P704)
On the latest version HT 1000, JT 1000, MT 2000, MTS 2000, and MTX
series radios, a strip connector, two female connectors and a strain
relief electrically connect the RF board with the controller board. On
earlier versions of these radios, the RF board and controller board were
connected using a jumper flex that soldered directly to the circuit
board solder pads.
An interconnect kit, REX4350A, is available to retrofit earlier version
jumper-flex radios with the later version strip connector parts. The
REX4350A kit includes the following items:
• CONNECTOR, Female (J301) 0905461X01
• CONNECTOR, Female (J704) 0905461X01
• CONNECTOR, Male (P301/P704) 0905461X01
• STRAIN RELIEF 4205507X01
• INSTRUCTIONS 6880309F14
!
C a u t i o n
If neighboring PBGA components are heated
above 365 degrees F. (185 degrees C.), they will
suffer die-bond delamination and possible
“popcorn” failure.
Содержание SYMBOL MT2000 Series
Страница 1: ...HT 1000 JT 1000 MT 2000 MTS 2000 and MTX Series Handie Talkie Portable Radios Service Manual ...
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Страница 24: ...2 Notes ...
Страница 78: ...56 Notes ...
Страница 147: ...Appendix A 9 Appendix Figure 2 Secure Module Location Detail ...
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