
Packaging
Pin-out and Package Information
MOTOROLA
DSP56007/D 3-7
Figure 3-3 80-pin Quad Flat Pack (QFP) Mechanical Information
L
MIN
MAX
MILLIMETERS
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
13.90
13.90
2.15
0.22
2.00
0.22
-
0.13
0.65
55
0.13
05
0.13
16.95
0.13
05
16.95
0.35
14.10
14.10
2.45
0.38
2.40
0.33
0.25
0.23
0.95
105
0.17
75
0.30
17.45
-
-
17.45
0.45
0.65 BSC
12.35 BSC
0.325 BSC
1.6 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
P
-A,B,D-
B
B
DETAIL A
F
D
N
SECTION B-B
J
C
0.20
A-B
D
S
S
M
-H-
DATUM
PLANE
DETAIL C
K
Q
R
T
W
X
U
0.01
-H-
DATUM
PLANE
DETAIL C
H
SEATING
PLANE
-C-
C
M
G
E
60
61
80
1
20
21
40
41
-D-
-B-
-A-
B
A
L
S
V
DETAIL A
H
0.20
A-B
D
S
S
M
C
0.20
A-B
D
A-B
0.05
S
S
M
0.20
C
A-B
D
0.05
A-B
S
S
0.20
H
A-B
D
MS
S
M
M
CASE 841B-01
ISSUE O
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
.
..
Содержание NXP SYMPHONY DSP56007
Страница 82: ......