MIC7401 EVALUATION BOARD
USER’S GUIDE
2016 - 2018 Microchip Technology Inc.
DS50002723A-page 37
Appendix B. Bill of Materials (BOM)
TABLE B-1:
BILL OF MATERIALS (BOM) - MIC7401 EVALUATION BOARD (ADM00812)
Qty.
Reference
Description
Manufacturer
Part Number
1
C1
Capacitor Ceramic, 2.2 µF, 10V, 10%,
X7S, SMD, 0402
TDK Corporation
C1005X7S1A225K050BC
1
C15
CAP TANT, 150 µF 10V, 10%, 100 m
,
SMD, D
AVX Corporation
TPSD157K010R0100
1
C16
Capacitor Ceramic, 0.47 µF, 6.3V, 10%,
X5R, SMD, 0603
Murata Electronics
North America, Inc.
GRM188R60J474KA01D
1
C17
Capacitor Ceramic,100 pF, 50V, 5%, NP0,
SMD, 0603
Cal-Chip Electronics
Inc.
GMC10CG101J50NTLF
7
C2, C4, C6, C7,
C9, C11, C13
Capacitor Ceramic,10 µF, 25V, 20%, X5R,
SMD, 0603
TDK Corporation
C1608X5R1E106M080AC
5
C3, C8, C10,
C12, C14
Capacitor Ceramic, 22 µF, 10V, 20%, X5R,
SMD, 0603
TDK Corporation
C1608X5R1A226M080AC
1
C5
Capacitor Ceramic, 1 µF, 16V, 10%, X5R,
SMD, 0603
AVX Corporation
0603YD105KAT2A
2
D1, D2
Diode SCTKY PMEG4005AEA,115,
470 mV, 500 mA, 40V, SOD-323
Nexperia
PMEG4005AEA,115
1
J1
Connector HDR-2.54 Male, 1x4 Gold
5.84 MH, TH R/A
Samtec, Inc.
TSW-104-08-S-S-RA
1
J2
Connector USB2.0 MICRO-B Female,
SMD R/A
FCI
10118192-0001LF
1
J3
Connector HDR-2.54 Male, 2x6 Gold
5.84 MH, TH Vertical
Samtec, Inc.
TSW-106-07-G-D
3
J4, J16, J17
Connector HDR-2.54 Male, 1x3 Tin,
5.84 MH,TH Vertical
Samtec, Inc.
TSW-103-07-T-S
6
J5, J6, J7, J8,
J9, J10
Connector HDR-2.54 Male, 2x2 Gold
5.84 MH, TH VERT
Wurth Elektronik
61300421121
1
JP1
Mechanical HW Jumper, 2.54 mm, 1x2
3M
969102-0000-DA
6
L1, L2, L3, L4,
L5, L6
Inductor 1 µH, 3.4A, 20%, SMD, 2520
TDK Corporation
VLS252012HBX-1R0M-1
4
PAD1, PAD2,
PAD3, PAD4
Mechanical HW Rubber PAD Hemisphere
D6.4 H1.9 Clear
3M
SJ5382
2
R1, R2
Resistor TKF, 100k, 1%, 1/10W, SMD,
0402
Panasonic
®
- ECG
ERJ-2RKF1003X
2
R3, R5
Resistor TKF, 4.7k, 5%, 1/10W, SMD,
0402
Panasonic - ECG
ERJ-2GEJ472X
2
R4, R6
Resistor TKF 470k 1% 1/16W SMD, 0402 ROHM
Semiconductor
MCR01MRTF4703
1
R7
Resistor TKF, 0R, SMD, 0402
Panasonic - ECG
ERJ-2GE0R00X
Note:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
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