Microchip Technology MCP43XXEV, Руководство пользователя

Страница: 17 / 43

Installation and Operation
©
2010 Microchip Technology Inc. DS51892A-page 17
TABLE 2-2: OPTIONAL PASSIVE COMPONENTS - NOT INSTALLED
(2)
Component Comment
C1, C2 Power supply bypass capacitors
(3)
C3, C4 PIC Crystal capacitors
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U,
R9U, R12U, R13U, R16U, R18U, R19U Pull-up resistor
R1D, R2D, R3D, R4D, R5D, R6D, R8D, R9D,
R10D, R11D, R12D, R14D, R15D, R16D, R17D,
R19D, R20D Pull-down resistor
(1)
U1, U2 Alternate package footprints
VDD, GND Power and Ground plane connection
points
Y1 Can connect to either PIC’ main oscillator
or to the Timer oscillator circuit.
P1, P3, P4, P5, P6, P8, P10, P11, P13, P14, P15,
P16, P17, P18, P20 Test Point connectors
Note 1: Whichever pin is the device’s V
DD
pin, that corresponding RXD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s V
DD
pin, then
install the bypass capacitor in the R8D footprint.
2: All passive components use the surface mount 805 footprint.
3: If the board is powered via the V
DD
and GND connection points, the use of bypass
capacitors on C1 and C2 may improve performance. The benefit is reduced if the
board is powered via the PICkit Serial interface.