Microchip Technology MCP39F501, Руководство пользователя

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MCP39F501 POWER MONITOR
DEMONSTRATION BOARD
USER’S GUIDE

2014 Microchip Technology Inc. DS50002240A-page 27
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
2 C1, C5 Cap. ceramic 18 pF 50V C0G 5%
0603 TDK Corporation C1608C0G1H180J
3 C2, C6, C10 Cap. ceramic 33 nF 50V 10% X7R
SMD 0603 TDK Corporation C1608X7R1H333K
10 C3 – C4, C7, C9,
C11, C15, C17,
C23 – C24, C26 Cap. ceramic 0.1 µF 16V 10% X7R
0603 TDK Corporation C1608X7R1C104K
2 C16, C22 Cap. ceramic 10 µF 10V X7R 20%
1206 TDK Corporation C3216X7R1A106M
1 C18 Cap. film 0.47 µF 305 VAC Power
Supply –
DO NOT POPULATE
EPCOS AG B32932A3474M
1 C19 Cap. film 0.01 µF 330 VAC
Suppress EPCOS AG B32911A3103M
1 C20 Cap. elect. 470 µF 16V 20% vs size F Panasonic
®
- ECG EEE-1CA471UP
1 C21 Cap. film 1.5 µF 275 VAC radial Panasonic - ECG ECQ-U2A155ML
2 C25, C27 Cap. ceramic 1 µF 10V X7R 20%
0603 TDK Corporation C1608X7R1A105M
1 C36 Cap. ceramic 0.1 µF 16V 10% X7R
0603 –
DO NOT POPULATE
TDK Corporation C1608X7R1C104K
2 D1 – D2 Diode std. rec. 1A 600V SMA ON Semiconductor
®
MRA4005T3G
1 D3 Diode Zener 15V 1W DO-41 Fairchild Semiconductor
®
1N4744A
1 J1 Conn. power jack male 2.5 mm
CLSD CUI Inc. PJ-002B
1 J2 Conn. recept. USB TH vert. 5 pos. Molex
®
Connector
Corporation
500075-1517
1 J3 Conn. hdr. male 0.100 1x6 pos. vert. Tyco Electronics 68001-106HLF
5 J4 – J5, J9,
J14 – J15 Conn. hdr. male 0.100 1x2 pos. vert. FCI 77311-118-02LF
1 J6 Module inlet. ang. GND W/M3 hole
PCB SCHURTER Inc. GSP1.9103.1
1 J7 Module outlet F screw-on PCB SCHURTER Inc. 6182.0033
5 J8, J11, J13,
J16 – J17 Conn. hdr. male 0.100 1x3 pos. vert. Tyco Electronics HDR M 1x3 Vertical
3 J10, J12, J18 Conn. hdr. male 0.100 1x2 pos. vert. FCI 77311-118-02LF
3 L1 – L2, L5 Ferrite 800 mA 150 m

0805 SMD Laird Technologies
®
LI0805H151R-10
2 L3 – L4 Bead core single 3.8 x 5.3 mm
Radial Panasonic - ECG EXC-ELSR35S
1 LD1 LED 2 x 1.2 mm RD/GN wtr. clr.
SMD Kingbright Corp. APHBM2012SURKCGKC
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.