MCP1726 EVALUATION
BOARD USER’S GUIDE
©
2005 Microchip Technology Inc.
DS51550A-page 7
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The MCP1726 1A LDO Evaluation Board demonstrates Microchip’s 1A Low-Quiescent
Current, Low-Dropout (LDO) regulator.The evaluation board contains two independent
circuits that allow the user to evaluate the MCP1726 in the 8-pin SOIC and the 8-pin
3X3 DFN packages. The evaluation board uses a potentiometer to adjust the output
voltage of the MCP1726 device across its entire output voltage range. The evaluation
board also allows for fixed-output voltage versions of the device to be used by simply
connecting the pins of a jumper connector.
2.2
FEATURES
The MCP1726 1A LDO Evaluation Board has the following features:
• Input Voltage Range: 2.3V to 6.0V
• Adjustable Output Voltage via a Potentiometer
• Output Voltage Shutdown via the SHDN Input
• Overcurrent Protection (device feature)
• Overtemperature Protection (device feature)
• Input Undervoltage Lockout (UVLO) Protection (device feature)
• Input Power and Power Good Indication (LED)
• Power Good Delay Adjust Capability
2.3
GETTING STARTED
The MCP1726 1A LDO Evaluation Board is fully assembled and tested over its input
voltage, output voltage and output current operating range. This board requires the use
of an external input voltage source (+2.3V to +6.0V) and an external load (electronic or
resistive). The Printed Circuit Board (PCB) design provides cooling for the MCP1726
devices. When the devices are operating with high power dissipation (over 1.0W at
room ambient), additional cooling may be required to keep the devices from going into
overtemperature shutdown.
The MCP1726 1A LDO Evaluation Board contains two circuits to evaluate; one for the
SOIC package and one for the 3X3 DFN package. These circuits are powered
independently of each other through separate connectors/test points. The circuitry for
evaluating the 3X3 DFN package has inputs labeled VIN1 and SHDN1, and outputs
labeled PWRGD1 and VOUT1. The circuitry for evaluating the SOIC package has
inputs labeled VIN2 and SHDN2, and outputs labeled PWRGD2 and VOUT2. The
ground connections for the board are all common to each other and are labeled as
GND. There are a total of four connection points for ground.
All of the connections to the MCP1726 1A LDO Evaluation Board are made through
surface-mount test points. These test points can be removed with a soldering iron if you
wish to solder wires directly to the pads that are provided on the board.
Содержание MCP1726
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