Bill of Materials (BOM)
2019 Microchip Technology Inc.
DS50002810A-page 53
B.2
HV MUX CONTROLLER BOARD (ADM00825)
2
U1_P1, U1_P2
Microchip Analog, FET Driver
Quad-Two Inverting – Two
Noninverting, MD1822K6-G,
16-Lead QFN
Microchip Technology
Inc.
MD1822K6-G
1
U2
IC Logic, HV2722 x16,
Analog Switch, 300V, QFN-64
Microchip Technology
Inc.
HV2722
1
U3
Microchip Analog, LDO, 3.3V,
MCP1702-3302E/CB
Microchip Technology
Inc.
MCP1702-3302E/CB
0
U4
DO NOT POPULATE -
Microchip Memory Serial SPI
Flash, 128 Mb (16M x 8),
108 MHz,
S25FL127SABMFV101,
SOIC-8
Cypress Semiconductor
Corp.
S25FL127SABMFV101
TABLE B-2:
ADM00825 – BILL OF MATERIALS (BOM)
Qty.
Reference
Description
Manufacturer
Part Number
8
C1, C10, C11,
C12, C27, C28,
C29, C90
Capacitor, Tantalum, 33
μ
F,
10V, 10%, 1.4
, SMD, B
KEMET
T494B336K010AT
2
C103, C105
Capacitor, Ceramic, 4.7
μ
F,
16V, 10%, X7R, SMD, 1206
KEMET
C1206C475K4RACTU
4
C2, C89, C104,
C106
Capacitor, Ceramic, 0.1
μ
F,
25V, 10%, X7R, SMD, 0603
Murata
Manufacturing Co., Ltd.
GRM188R71E104KA01D
1
C3
Capacitor, Tantalum,100
μ
F,
6.3V, 10%, 400 m
SMD, B
AVX Corporation
TPSB107K006R0400
7
C4, C13, C17,
C21, C30, C33,
C37
Capacitor, Ceramic, 47 nF,
16V, 10%, X7R, SMD, 0603
Murata
Manufacturing Co., Ltd.
GRM188R71C473KA01D
1
C41
Capacitor, Ceramic,
22000 pF, 50V, 5%, X7R,
SMD, 0603
AVX Corporation
06035C223JAT2A
10
C42, C50, C52,
C54, C56, C58,
C60, C62, C64,
C66
Capacitor, Ceramic, 0.1
μ
F
50V, 20%, X7R, SMD, 0603
TDK Corporation
C1608X7R1H104M
12
C43, C44, C45,
C46, C51, C53,
C55, C57, C59,
C61, C63, C65
Capacitor, Ceramic, 10
μ
F,
10V, 10%, X7R, SMD, 0805
Murata
Manufacturing Co., Ltd.
GRM21BR71A106KE51L
3
C47, C48, C49
Capacitor, Ceramic, 10
μ
F,
35V, 10%, X5R, SMD, 1206
Taiyo Yuden Co., Ltd.
GMK316BJ106KL-T
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-1:
ADM00946 – BILL OF MATERIALS (BOM)
(
1
)
(CONTINUED)
Qty.
Reference
Description
Manufacturer
Part Number
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
Содержание HV2722
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