Microchip Technology 10-Pin MSOP, Руководство пользователя

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Installation and Operation
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2017 Microchip Technology Inc. DS50002569A-page 19
2.4 10-PIN MSOP AND 8-PIN MSOP EVALUATION BOARD DESCRIPTION
This section describes the working principles and limitations that should be taken into
account when using the10-Pin MSOP and 8-Pin MSOP Evaluation Board.
2.4.1 Power and Ground
The10-Pin MSOP and 8-Pin MSOP Evaluation Board has a V
DD
pad and a V
SS
pad.
These pads can have connection posts installed that allows easy connection to the
power (V
DD
) and ground (V
SS
) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to RUx and ground plane to RDx components).
2.4.2 PCB Pads
For each package pin (pins 1 to 10), there is a PCB pad (pads 1 to 10). The device has
power pins (V
DD
) and ground pins (V
SS
). To ease connections on the PCB, vias to the
power and ground plane have been installed close to each PCB pad. This allows any
pad to be connected to the power or ground plane, so when power is connected to the
V
DD
and V
SS
pads, it is also connected to the appropriate device pin (see Figure 2-5 ).
FIGURE 2-5: Connecting the PCB Pad to Either the VDD or VSS Pins.
The series components (RSx) can be used in conjunction with the RDx components to
create passive filters. For example, when using a PIC microcontroller, one could gen-
erate an analog signal by low pass-filtering the PWM signal coming from a digital output
pin. In order to use the RSx footprint, the PCB trace passing through the middle of the
footprint should be cut using a sharp tool.