- Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
12.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
*Most important matter is accurate setting of IC to the
corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
12.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
36
Содержание KX-TSC35MXW
Страница 4: ...3 DISPLAY 4...
Страница 7: ...5 2 Time and Date 7...
Страница 8: ...8...
Страница 9: ...5 3 LCD Contrast 9...
Страница 10: ...5 4 Making Calls 10...
Страница 11: ...11...
Страница 12: ...5 5 AnswerinCalls 12...
Страница 13: ...5 6 Caller ID Service 13...
Страница 14: ...14...
Страница 15: ...5 7 Usin the Caller List 5 8 Viewing the Caller List 15...
Страница 16: ...16...
Страница 17: ...5 9 Calling Back from the Caller List 5 10 Editing the Caller s Phone Number 5 11 Dial Lock 17...
Страница 19: ...5 13 FLASH Button 19...
Страница 20: ...6 DISASSEMBLY INSTRUCTIONS 20...
Страница 22: ...7 2 Pulse Dialing Problems 7 3 Tone Dialing Problems handset 22...
Страница 28: ...28...
Страница 29: ...10 2 CPU DATA IC801 29...
Страница 30: ...30...
Страница 31: ...10 3 RINGER IC IC1 31...
Страница 37: ...13 TERMINAL GUIDE OF ICS TRANSISTORS AND DIODES 14 CABINET AND ELECTRICAL PARTS 37...
Страница 38: ...15 ACCESSORIES AND PACKING MATERIALS 38...
Страница 53: ...CN801 MIC 2 1 24 23 PQUP11143ZA KX TSC35MXW OPERATION BOARD COMPONENT VIEW...