Quick Start Guide
HMC3070A-M
Description:
HMC3070A-M 800x480 pixels, 7.0” color TFT, with three
expansion slots.
Contents:
—
1 HMC3070A-M (in plastic bag with protective cover sheet
on the screen)
—
1 plastic bag containing 4 mounting clamps (each clamp
consisting of cap nut, bolt, and clamp)
—
1 three prong green power plug*
—
Cardboard package inserts
—
Quick Start Guide
*Note: Connector manufacturer may vary.
Programming software (MAPware-7000), cables, and power
supply purchased separately.
Panel Mounting and Panel Cutout:
HMC3070A-M
Tighten the mounting screws evenly to a torque between 0.4 Nm to
maintain water and dust resistance. Make sure the panel is not dirty
and warped and that it is strong enough to hold the unit.
Note: Maximum Panel thickness (on which unit is to be mounted)
should be 6.0 mm (Tolerance: +/-0.2 mm).
Doc. No. 1011-0302
Maple Systems, Inc. 808 134th St SW, Suite 120, Everett, WA 98204-7333 www.maplesystems.com
Specifications:
The HMC3070A-M is a combination operator-based HMI (Human
Machine Interface) with built-in PLC (Programmable Logic
Controller) operation. It communicates with external PLCs over
serial communications ports to read/write data. Three I/O
expansion modules can be attached.
Power:
24VDC +/- 15%, 20W (with 3
expansions)
Display:
7.0” TFT (800 x 480 pixels)
Color graphics display
Bezel:
NEMA 4X (IP 66) rated
Touchscreen:
4-wire analog resistive
LEDs:
Power indicator
CPU:
32-bit RISC, 454 MHz
Memory:
45 MB Max. Application Memory
Serial Comms (DE9S):
Two serial ports
(RS232/RS485/RS422)
USB Slave (Micro Type B):
Upload/download projects
USB Host (Standard Type A): Data storage
Ethernet (RJ45):
10/100 Mbps
SD card:
Micro SD (high capacity- 4 to 32
GB)
Expansion ports:
Three for optional HMC3 I/O
modules
Operating temp:
0 to 60° C
Humidity:
10% to 90% (non-condensing)
Dimensions (WxHxD):
7.32 x 5.43 x 1.22 inches
[186.0 x 138.0 x 31.0mm]
Panel cutout:
4.37 x 3.15 inches [111 x 80mm]
Mounting Module to Panel:
Step 2: Tighten clamps evenly to prevent warping. Continue to
tighten until a torque force of 0.4-0.5 Nm is obtained.
Step 3: HMC3070 should be aligned evenly with the cutout with
no warping present after clamps are tightened.
Port Details:
Note: connect shell to shield of cable.
Grounding:
The HMC3070 should have a good electrical connection to earth
ground via the power connector for safety and to reduce electrical
noise. The HMC unit should be grounded separately from other
high-power systems.
Note: Do not use a ground connection that has potential
impedance (such as painted screws) or is subject to vibration.
Expansion I/O Modules:
The HMC3070A-M has three expansion slots that you can use to
connect I/O modules. Below is a listing of modules currently
available (consult Maple Systems website for additional
information).
HMC3-M1616P:
16 digital input, 16 PNP-type digital
output
HMC3-M1614Y:
16 digital input, 14 digital output
(12 relay, 2 PNP-type)
HMC3-M1212P0200:
12 digital input, 12 PNP-type digital
output, 2 analog input
HMC3-M1212Y0200:
12 digital input, 12 digital output
(10 relay, 2 PNP-type), 2 analog
input
HMC3-M1210P0201:
12 digital input, 10 PNP-type digital
output, 2 analog input and 1 analog
output.
HMC3-M1210Y0201:
12 digital input, 10 digital output (8
relay, 2 PNP-type), 2 analog input,
and 1 analog output.
HMC3-M0808P0401T:
8 digital input, 8 PNP-type digital
output, 4 analog input and 1 analog
output.
HMC3-M0808Y0401T:
8 digital input, 8 digital output (6
relay, 2 PNP-type), 4 analog input,
and 1 analog output.
Rev 02, 06/25/2018
COM1
COM2
Pin
Number
Name
Description
1
RX-
RS422 receive -
2
TX-
RS422 transmit -
3
RX+
RS422 r
4
TX+
RS422 tr
5
GND
Ground
6
RXD
RS232 receive
7
TXD
RS232 transmit
Pin
Number
Name
Description
1
TX+
RS422 tr
2
TXD
RS232 transmit
3
RXD
RS232 receive
4
RX+
RS422 r
5
GND
Ground
6
NC
No connection
7
NC
No connection
8
TX-
RS422 transmit -
9
RX-
RS422 receive -
