Magnavox MC132EMG/17, Руководство по обслуживанию

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1-2-2 TVVCRN_PC_SN
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To reach at least a solder-temperature of 400°C,
•
To stabilize the adjusted temperature at the solder-
tip
•
To exchange solder-tips for different applications.
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Adjust your solder tool so that a temperature around
360°C - 380°C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
•
Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
•
Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
•
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicator-
label in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
•
On our website
www.atyourservice.ce.Philips.com you find more
information to:
•
BGA-de-/soldering (+ baking instructions)
•
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
Replacement Procedures for
Leadless (Chip) Components
The Following Procedures are
Recommended for the Replacement of the
Leadless Components Used in this Unit.
1. Preparation for replacement
1-1. Pb free solder
a. Soldering Iron
Use a soldering iron for Pb free solder.
b. Solder
Be sure to use Pb free solder.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
1-2. Standard solder
a. Soldering Iron
Use a pencil-type soldering iron (less than 30
watts).
b. Solder
Eutectic solder (Tin 63%, Lead 37%) is
recommended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
Note:
a. Leadless components must not be reused after
removal.
b. Excessive mechanical stress and rubbing for
the component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers
and alternately apply heat to both electrodes. When
the solder on both electrodes has melted, remove
leadless component with a twisting motion.
Note:
a. Do not attempt to lift the component off the
board until the component is completely
disconnected from the board by the twisting
action.
b. Take care not to break the copper foil on the
printed board
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