LSI Logic Confidential
18-72
Specifications
Copyright © 2001, 2002 by LSI Logic Corporation. All rights reserved.
18.4.2 Recommended Manufacturing Conditions
LSI Logic recommends the following conditions for surface mounting the
DMN-8600 processor:
•
Use chlorineless rosin flux.
•
Remove flux sufficiently from the product during the washing
process.
•
Be aware that resonance may occur during ultrasonic washing based
on the frequency and PCB shape. This resonance might affect ball
strength.
specifies the recommended hot air or infrared (IR) solder
reflow conditions.
Table 18.36 Recommended Hot Air or IR Solder Reflow Conditions
Parameter
Specification
Preheating Temperature
140 to 160 ˚C
Preheating Temperature Hold Time
60 to 120 s
Heating Acceleration
1 to 3 ˚C/s maximum
Package Case Temperature
220˚C
Peak Temperature Hold Time
10 s maximum
High Temperature Region Hold Time
60 s maximum @ 183 ˚C
Cooling Rate
5 ˚C/s maximum
Содержание DMN-8600
Страница 14: ...LSI Logic Confidential xiv Contents Copyright 2001 2002 by LSI Logic Corporation All rights reserved ...
Страница 18: ...LSI Logic Confidential xviii Copyright 2001 2002 by LSI Logic Corporation All rights reserved ...
Страница 64: ...LSI Logic Confidential 7 6 Memory Mapping Copyright 2001 2002 by LSI Logic Corporation All rights reserved ...