1-5
SERVICING PRECAUTIONS
CAUTION : Before servicing the HDD/DVD Recorder cov-
ered by this service data and its supplements and addends,
read and follow the SAFETY PRECAUTIONS. NOTE : if
unforeseen circumstances create conflict between the fol-
lowing servicing precautions and any of the safety precau-
tions in this publications, always follow the safety precau-
tions.
Remembers Safety First:
General Servicing Precautions
1. Always unplug the HDD/DVD Recorder AC power cord
from the AC power source before:
(1) Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2) Disconnection or reconnecting any internal electrical
plug or other electrical connection.
(3) Connecting a test substitute in parallel with an elec-
trolytic capacitor.
Caution
: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may result
in an explosion hazard.
2. Do not spray chemicals on or near this HDD/DVD
Recorder or any of its assemblies.
3. Unless specified otherwise in this service data, clean
electrical contacts by applying an appropriate contact
cleaning solution to the contacts with a pipe cleaner,
cotton-tipped swab, or comparable soft applicator.
Unless specified otherwise in this service data, lubrication
of contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with
whitch instruments covered by this service manual might
be equipped.
5. Do not apply AC power to this HDD/DVD Recorder and/or
any of its electrical assemblies unless all solid-state
device heat sinks are cerrectly installed.
6. Always connect test instrument ground lead to the
appropriate ground before connection the test instrument
positive lead. Always remove the test instrument ground
lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn
the power on. Connect an insulation resistance meter(500V)
to the blades of the attachment plug. The insulation resis-
tance between each blade of the attachment plug and acces-
sible conductive parts (Note 1) should be more than 1M-
ohm.
Note 1 :
Accessible Conductive Parts including Metal pan-
els, Input terminals, Earphone jacks, etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field
effect transistors and semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor compo-
nent or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a commer-
cially available discharging wrist strap device, which
should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grouned-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static solder removal device. Some
solder removal devices not classified a “anti-static” can
generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charge sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protec
tive package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with
leads electrically shorted together by conductive foam,
aluminum foil, or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
Caution : Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Normally harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static elec-
tricity sufficient to damage an ES device.)
Содержание RH4820W
Страница 40: ...3 41 3 42 2 E5 BGA POWER UART2 CIRCUIT DIAGRAM E5 BAG POWER UART2 ...
Страница 43: ...3 47 3 48 5 1394 ETHERNET CONNECTOR CIRCUIT DIAGRAM 1394 ETHERNET CONNECTOR ...
Страница 44: ...3 49 3 50 VIDEO IN OUT 6 VIDEO IN OUT CIRCUIT DIAGRAM ...
Страница 45: ...3 51 3 52 7 AUDIO IN OUT CIRCUIT DIAGRAM AUDIO IN OUT ...
Страница 46: ...3 53 3 54 8 I O MICOM CIRCUIT DIAGRAM SR17208A I O MICOM ...
Страница 47: ...3 55 3 56 9 TUNER VIDEO IN OUT CIRCUIT DIAGRAM SR17209A TUNER VIDEO IN OUT 3 9K 3 9K ...
Страница 48: ...3 57 3 58 10 FRONT CIRCUIT DIAGRAM HDD VDR_FRONT ...
Страница 54: ...3 69 3 70 PRINTED CIRCUIT DIAGRAMS 1 MAIN P C BOARD TOP SIDE LOCATION GUIDE ...
Страница 55: ...3 71 3 72 2 MAIN P C BOARD BOTTOM SIDE LOCATION GUIDE ...
Страница 56: ...3 73 3 74 3 I O P C BOARD LOCATION GUIDE 4 JACK P C BOARD LOCATION GUIDE LOCATION GUIDE LOCATION GUIDE ...
Страница 57: ...3 75 3 76 5 FRONT P C BOARD LOCATION GUIDE 6 KEY P C BOARD ...
Страница 58: ...3 77 3 78 7 POWER P C BOARD LOCATION GUIDE ...
Страница 88: ...3 108 4 IC302 uPD76f0047 MICOM Pin Assignment ...
Страница 93: ...3 113 3 Main Clock2 for IC302 20MHz GND LEVEL X301 IC302 PIN 13 4 SDRAM Clock GND LEVEL MCLK IC201 PIN 35 ...
Страница 110: ......
Страница 112: ...3 132 3 133 2 DSP CIRCUIT DIAGRAM No Power No operation DSP IC RESET IC SDRAM R259 0Ω ...
Страница 114: ...3 136 3 137 PRINTED CIRCUIT DIAGRAMS 1 MAIN P C BOARD LOCATION GUIDE ...