14. EXPLODED VIEW & REPLACEMENT PART LIST
- 185 -
LGE Internal Use Only
Copyright © 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Level Location No.
Description
PartNumber
Spec
Remark
6
U802
IC Assembly
EUSY0434401 BCM43362SKUBG BCM43362SKUBG BROADCOM
ASIA DISTRIBUTION PTE LTD
6
X801
Oscillator, TCXO
EXST0001901
TG-5010LH-87N 26MHZ 2.5PPM 2.8V
32.0x25.0x10.0MM - SMD R/TP EPSON TOYOCOM
CORP
6
X202
Crystal
EXXY0024301 CM315(12.5PF) 32.768KHZ 20PPM 12.5PF 32*15
SMD R/TP CITIZEN DISPLAYS CO., LTD.
6
X201
Crystal
EXXY0025701
TSX- 3225 TSX- 3225, 26 MHz, 10 PPM, 8 pF, 40 ohm,
SMD, 32X25X0.6, X-Tal (Infinion chip), Pb-Free EPSON
TOYOCOM CORP
6
J501
Jack, Phone
EAG62831701
KJA-PH-3-0176 4P 4P ANGLE R/TP 3.5M BLACK 5P
6.5x12.6x4.0t, Short Detect, All DIP type KSD CO.,
LTD
6
CN402
Connector, Terminal
Block
EAG62832501 KQ03LV2-3R 3P 3.00MM ANGLE SMD T/REEL -
HIROSE KOREA CO., LTD
6
FL101
Filter, Saw, Dual
EAM62071301 B9836 GSM QUAD 1.8*1.4*0.4 SMD R/TP 10P
EPCOS PTE LTD.
6
U401
IC, Mini ABB
EAN61833301
LP8727 1.6V to 5.5V 0SEC 0SEC 0W 8 Mini ABB Basic
MUIC, Charger IC WL-CSP R/TP 25P NATIONAL
SEMICONDUCTOR ASIA PACIFIC PTE. LTD.
6
U301
IC, MCP, NAND
EAN61927501
H9DA2GH1GHMMMR-46M NAND/2G SDRAM/1G
1.7VTO1.95V 8.0x9.0x0.9 TR 130P NAND+DDR
SDRAM FBGA 2Gb NAND(LB/11Gb
DRAM(DDR/200MHz/16Mx4x16) HYNIX
SEMICONDUCTOR INC.
6
U101
Module,
Tx Module
EAT61353301
RF7171 33DBM, 33DBM, 30DBM, 30DBM 0DB 36%,
36%, 32%, 32% 0A 80UA 0DB 0DBM 0DBM 24P
6.63x5.24x1.015MM GPRS QUAD TX DUAL RX
MODULE, SP4T, 6.63*5.24*1.015, 24pin RF MICRO
DEVICES INC
6
C524
Capacitor, Ceramic,
Chip
ECCH0000129
MCH155A121JK 120pF 5% 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
C231
Capacitor, Ceramic,
Chip
ECCH0000137
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION