3. TECHNICAL BRIEF
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Copyright © 01 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Copyright © 2012 LG Electronics. Inc. All right reserved.
O nly for training and service purposes
LGE Internal Use Only
12
3. TECHNICAL BRIEF
3.1.1 Platform features
General
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-band , audio-band ,RF ,FM and base-band analog front ends
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-ball , 0.5mm pitch package
MCU subsystem
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-S 32-bit RISC processor
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-performance multi-layer AMBA bus
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-Purpose timers.
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Serial flash interface
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User interfaces
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-row x 5-column keypad controller with a hardware scanner
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-time clock (RTC) operating with a separate power supply
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-purpose I/Os (GPIOs)
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Connectivity
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3.1.2 Modem features
Radio interface and baseband front-end
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-end
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-sigma ADC converts the downlink IF baseband
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-bit D/A converter for Automatic Power Control (APC)
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3.1.1 Platform features
3.1.2 Modem features