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3. Technical Brief
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
The low-frequency clock is always present, in some applications even when the chipset is powered
down.
F. STLC2590C
•
WFBGA 5.0 x 7.5 x 0.8 mm lead-free/RoHs compliant 100 pins
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External component: B-BPF (Bluetooth)
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PCB footprint < 45mm2
•
Based on Ericsson Technology Licensing Baseband Core (EBC)
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Bluetooth™ specification compliance: V2.0 + EDR.
- Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability
- Support ACL and SCO links
- Extended SCO (eSCO) links
- Faster Connection
•
HW support for packet types
- ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5
- SCO: HV1, HV3 and DV
- eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5
- Adaptive Frequency Hopping (AFH)
•
Transmit Power
- Power Class 2 and Power Class 1.5 (above 4dBm)
- Programmable output power
- Power Class 1 compatible
•
HCI
- HCI H4 Transport Layer
- HCI proprietary commands (e.g. peripherals control)
- Single HCI command for patch/upgrade download
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Supports Pitch-Period Error Concealment (PPEC)
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Efficient and flexible support for WLAN coexistence in collocated scenario
•
Low power consumption
- Ultra low power architecture with 3 different low-power levels
- Deep Sleep modes, including Host power saving feature
- Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device
•
Communication interfaces
- Fast UART up to 4Mbit/s
- SPI interface
- PCM interface
- Up to 10 additional flexibly programmable GPIOs
- External interrupts possible through the GPIOs
- Fast master I2C interface
Содержание KU580
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