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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
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ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ
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Figure. 3.7.1 MAIN MEMORY BLOCK DIAGRAM
3. TECHNICAL BRIEF
3.7 MEMORY
GX300 is composed of 3 memories.
2 Main Memory(NOR+pSRAM) are connected each Main Chip(SIM1 AGR+ / SIM2 AGR+).
And 1 DPRAM is used to communicate between 2 Main Memory(NOR+pSRAM).
3.7.1 Main memory (PF38F6066M0Y3DE, U100 / PF38F3050M0Y3DE,U401 )
Содержание GX300
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