TABLE OF CONTENTS
INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~4
SPECIFICATIONS.................................................................................................................................................................5~8
LOCATION OF CUSTOMER CONTROLS .........................................................................................................................9~10
DISASSEMBLY .................................................................................................................................................................11~12
1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................11
1-1. Bottom Chassis ..........................................................................................................................................................11
1-2. Front Bezel Assy ........................................................................................................................................................11
1-3. Cabinet and Main Circuit Board .................................................................................................................................11
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................11
2-1. Pick-up Unit................................................................................................................................................................11
2-2. Pick-up ......................................................................................................................................................................12
EXPLODED VIEW .............................................................................................................................................................13~14
MECHANICAL REPLACEMENT PARTS LIST ......................................................................................................................15
GLOSSARY .............................................................................................................................................................................16
THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................17~23
1. Recording Layer ..............................................................................................................................................................17
2. Disc Specification ............................................................................................................................................................17
3. Disc Materials ..................................................................................................................................................................18
4. Reading Process of Optical Disc .....................................................................................................................................19
5. Writing Process of CD-R Disc .........................................................................................................................................20
6. Writing Process of CD-RW Disc ......................................................................................................................................20
7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................21
8. Function of PCA and PMA area ......................................................................................................................................22
9. OPC and ROPC ..............................................................................................................................................................22
10. Writing Process of DISC................................................................................................................................................23
THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVDD-ROM .................................................................24~32
1. Recording Layer ..............................................................................................................................................................24
2. Disc Specification ............................................................................................................................................................25
3. Disc Materials ..................................................................................................................................................................25
4. Writing Pulse Waveform of DVD+R.................................................................................................................................28
5. Writing Pulse Waveform DVD+RW .................................................................................................................................30
6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................31
DVD & CD DATA PROCESSING......................................................................................................................................33~36
1. Data Processing Flow......................................................................................................................................................33
2. Copy Protection and Regional Code Management Block ...............................................................................................34
3. About Prevention the DVD-ROm from to be copy ...........................................................................................................35
4. About the DVD-ROM Regional Code ..............................................................................................................................36
INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................37~39
1. Block Diagram of the Pick-up(HOP-7532TS) ..................................................................................................................37
2. Pick up Pin Assignment...................................................................................................................................................38
3. Signal detection of the P/U ..............................................................................................................................................39
DESCRIPTION OF CIRCUIT.............................................................................................................................................40~47
1. ALPC Circuit ....................................................................................................................................................................40
2. Focus Circuit....................................................................................................................................................................42
3. Tracking & Sled Circuit ....................................................................................................................................................43
4. Spindle Circuit .................................................................................................................................................................46
MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................48~68
TROUBLESHOOTING GUIDE ..........................................................................................................................................69~86
BLOCK DIAGRAM ..................................................................................................................................................................88
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................89~92
ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................93
CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.
