TABLE OF CONTENTS
INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~4
SPECIFICATIONS.................................................................................................................................................................5~8
LOCATION OF CUSTOMER CONTROLS .........................................................................................................................9~10
DISASSEMBLY .................................................................................................................................................................11~12
1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................11
1-1. Bottom Chassis ..........................................................................................................................................................11
1-2. Front Bezel Assy ........................................................................................................................................................11
1-3. Cabinet and Main Circuit Board .................................................................................................................................11
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................11
2-1. Pick-up Unit................................................................................................................................................................11
2-2. Pick-up ......................................................................................................................................................................12
EXPLODED VIEW .............................................................................................................................................................13~14
MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................15~16
GLOSSARY .............................................................................................................................................................................17
THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................18~24
1. Recording Layer ..............................................................................................................................................................18
2. Disc Specification ............................................................................................................................................................18
3. Disc Materials ..................................................................................................................................................................19
4. Reading Process of Optical Disc .....................................................................................................................................20
5. Writing Process of CD-R Disc .........................................................................................................................................21
6. Writing Process of CD-RW Disc ......................................................................................................................................21
7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................22
8. Function of PCA and PMA area ......................................................................................................................................23
9. OPC and ROPC ..............................................................................................................................................................23
10. Writing Process of DISC................................................................................................................................................24
THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVDD-ROM .................................................................25~33
1. Recording Layer ..............................................................................................................................................................25
2. Disc Specification ............................................................................................................................................................26
3. Disc Materials ..................................................................................................................................................................26
4. Writing Pulse Waveform of DVD+R.................................................................................................................................29
5. Writing Pulse Waveform DVD+RW .................................................................................................................................31
6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................32
DVD & CD DATA PROCESSING......................................................................................................................................34~37
1. Data Processing Flow......................................................................................................................................................34
2. Copy Protection and Regional Code Management Block ...............................................................................................35
3. About Prevention the DVD-ROm from to be copy ...........................................................................................................36
4. About the DVD-ROM Regional Code ..............................................................................................................................37
INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................38~39
1. Block Diagram of the Pick-up(HOP-8521T).....................................................................................................................38
2. Pick up Pin Assignment...................................................................................................................................................39
3. Signal detection of the P/U ..............................................................................................................................................40
DESCRIPTION OF CIRCUIT.............................................................................................................................................41~48
1. ALPC Circuit ....................................................................................................................................................................41
2. Focus Circuit....................................................................................................................................................................43
3. Tracking & Sled Circuit ....................................................................................................................................................44
4. Spindle Circuit .................................................................................................................................................................47
MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................49~74
TROUBLESHOOTING GUIDE ..........................................................................................................................................75~91
BLOCK DIAGRAM ..................................................................................................................................................................92
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................93~96
ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................97
CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.
