Customer Oriented R&D
20. 3D SET Layout
Power Board
3DF
Main
Y Board
Z Board
ASIC
X board
Changed Point
1. Add 3D formatter board (3DF)
- 3DF board received LVDS data and make L/R image for 3D
- Main to 3DF cable : 51pin FFC / 3DF to ASIC cable : 80pin FFC
2. Change the module ASIC board
- ISIS-F3.0 to ISIS-A1.0 for 3D
3. Add 3D IR emitter sub Assy and wafer (Main Board)
- 3D IR emitter make 3D sync for 3D Active glasses
- IR emitter signal form ASIC to Main board and it connect to IR emitter Assy through 4pin wafer on Main board
4. BCM3556 Revision (Main Board)
- BCM3556C1 -> BCM3556CP
- Change the BCM version to support HDMI1.4a 3D
50PX950-ZA model image
50PX950-ZA model block diagram
IR emitter assy - front
IR emitter assy - back
Содержание 50PX950
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Страница 42: ...Customer Oriented R D Breakthrough 10년 GP2 BR Chassis SYS_RESET 43 2ms OK A2 5V D1 2V D1 8V SYS_RESET ...
Страница 44: ...Customer Oriented R D Breakthrough 10년 GP2 BR PDP Audio amp reset spec On power up reset be held low 222ms 100 ...
Страница 49: ...Customer Oriented R D Breakthrough GPIO Structure ...
Страница 50: ...Customer Oriented R D Breakthrough GPIO Structure ...
Страница 51: ...Customer Oriented R D Breakthrough GPIO Structure ...
Страница 58: ...Customer Oriented R D Breakthrough No OSD Trouble Shooting Module Power Sequence ...