LG 32LH570B, Руководство по обслуживанию

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Product Disassembly Process
List the basic steps that should typically be followed to remove components and materials requiring
selective treatment:
1.OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting the locations
of items contained within the product which require selective treatment
(with descriptions and arrows identifying locations) can be inserted below:
1 Unlock screw (“A-10EA”) to separate back cover assembly.
[Fig.1]
2
Separate speaker assembly from back cover.
Separate the cushion (B,C,D) from backcover.
Separate the WIFI board
（
L) from backcover.
Unlock screw (”E-2EA”) to separate the base.
[Fig.2]
3 Unlock screw (”F-4EA”) to sepparate main board and AV bracket (H, I). [Fig.3]
4
Separate the receive assembly from front cover;
Separate the cushion (J) from receive board;
Separate the receive board from IR LENS;
Separate the PC sheet (K) from IR LENS.
[Fig.4]
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