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LR9101 Specifications Sheet Rev. 2.0
9. RoHS soldering profile
9.1 Reflow profile
High quality, low defect soldering requires identifying the optimum temperature profile for
reflowing the solder paste. To have the correct profile assures components, boards, and
solder joints are not damaged and reliable solder connection is achievable. Profiles are
essential for establishing and maintaining processes. You must be able to repeat the profile
to achieve process consistency. The heating and cooling rise rates must be compatible with
the solder paste and components. The amount of time that the assembly is exposed to
certain temperatures must first be defined and then maintained.
Average ramp-up rate
3
℃
/second max.
Preheat (Tsmax
– Tsmin, ts)
150~200
℃
; 60~180seconds
Time maintained above ( TL, tL)
217
℃
; 60~150seconds
Peak Temperature (Tp)
255~260
℃
; 10~20seconds
Ramp-down rate
6
℃
/second max.
Time 25
℃
to Peak Temperature
8 minutes max.
Maximum number of reflow cycles
≤
3